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YONGYUTAI BC847C
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- YONGYUTAI BC847C
- Type
- YONGYUTAI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YONGYUTAI
- Electronic Component
- BC847C
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 NPN
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0.031g
- Electronic Component
- 1
- Electronic Component
- BM0226337765
- Transistor Type
- NPN
- Frequency(f T)
- 100MHz
- Power Dissipation(Pd)
- 200mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Collector Current(Ic)
- 100mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BC847C 产品概述
一、产品简介
YONGYUTAI（永裕泰）BC847C 是一款小信号 NPN 双极型晶体管，适用于低功耗开关与小信号放大场合。器件采用 SOT-23 封装，体积小、便于表面贴装，兼顾通用性与成本效益，适合批量生产与模块化电路设计。
二、主要电气参数
- 晶体管类型：NPN
- 直流电流增益 hFE：高达 800（在 Ic = 2 mA，VCE = 5 V 条件下）
- 集电极-射极击穿电压 VCEO：45 V
- 最大集电极电流 Ic：100 mA
- 集电极截止电流 ICBO：≤ 10 nA（常温）
- 特征频率 fT：约 100 MHz，适合高频小信号放大
- 耗散功率 Pd：200 mW（封装与环境依赖）
- 发射极-基极击穿电压 VEBO：6 V
- 集射极饱和电压 VCE(sat)：约 500 mV（在 Ic = 100 mA，Ib = 5 mA 时典型值）
三、封装与热特性
器件封装为 SOT-23，适合表面贴装工艺。由于最大耗散功率仅 200 mW，布局时需注意散热路径与铜箔面积，避免长时间高功耗工作导致结温上升，从而影响可靠性与增益特性。
四、典型应用
- 低电流前置放大器与信号检测
- 小信号开关与逻辑驱动（非持续大电流场合）
- 高频小信号放大与混合信号前端（频率可达数十 MHz）
- 便携式与电池供电设备的模拟电路
五、使用注意事项
- 高增益特性在低电流工作点表现最好，但需注意稳定性与反馈引起的振荡，必要时加入基极电阻或旁路电容。
- 避免在超过 VCEO、VEBO 与 Pd 的条件下使用，以防击穿与热失效。
- 建议在焊接与回流时遵循 SOT-23 的温度曲线，防止封装过热。
- 留意 ESD 防护措施，基极对静电敏感。
六、订购与替代
品牌：YONGYUTAI（永裕泰）；封装：SOT-23。若需更高功耗或更低饱和电压的替代，可考虑封装体积更大或专用低饱和管型，但需核对 VCE、Ic 与增益特性是否匹配设计要求。
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