WMSIC Electronic Components

YANGJIE YJG40G10A

ModelYJG40G10A
PackagePDFN5060-8L
BrandYANGJIE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

13 specifications

Core information

Product name
YANGJIE YJG40G10A
Type
PDFN5060-8L
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YANGJIE
Electronic Component
YJG40G10A
Electronic Component
1
Package
PDFN5060-8L
Electronic Component
0.18g
Electronic Component
1
Electronic Component
BM0230814845
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

YJG40G10A 产品概述

YJG40G10A 是扬杰(YANGJIE)推出的一款高压、低导通阻抗的 N 沟道功率场效应晶体管,适用于要求高电压耐受和较大电流承载能力的开关电源与电力变换场合。该器件在 100V 漏源电压等级下提供 40A 连续漏极电流及低至 21.5mΩ 的导通电阻(Vgs=4.5V),在高效能和紧凑封装之间取得了良好平衡,适合中高压开关应用。

一、主要参数概览

  • 类型:N 沟道 MOSFET(场效应晶体管)
  • 型号:YJG40G10A(品牌:YANGJIE 扬杰)
  • 漏源电压 Vdss:100 V
  • 连续漏极电流 Id:40 A
  • 导通电阻 RDS(on):21.5 mΩ @ Vgs = 4.5 V
  • 阈值电压 Vgs(th):2.5 V @ 250 μA
  • 总栅极电荷量 Qg:16 nC @ 10 V
  • 输入电容 Ciss:1.051 nF
  • 反向传输电容 Crss:18 pF
  • 输出电容 Coss:399 pF
  • 功耗 Pd:81 W
  • 工作温度范围:-55 ℃ ~ +150 ℃
  • 封装:PDFN5060-8L

二、主要特性与优势

  • 100V 耐压配合 40A 电流容量,适合中高压直流母线与中大功率开关场景。
  • 在逻辑级驱动(4.5V)下仍能达到较低的导通电阻(21.5 mΩ),利于降低导通损耗,提高系统效率。
  • 较低的输入电容(Ciss ≈ 1.051 nF)与适中的栅极电荷(Qg = 16 nC)在切换速度与驱动能耗之间取得平衡,便于驱动器选型与热设计。
  • 小型 PDFN5060-8L 封装有利于高密度 PCB 布局,同时通过合理的底部散热垫可实现较好热流出。

三、典型应用场景

  • 开关电源(SMPS):主开关或同步整流 MOSFET,用于高效率 DC-DC 转换器。
  • 功率因数校正(PFC)电路与反激/正激变换器中的高压开关器件。
  • 电机驱动前级、半桥/全桥驱动应用(需配套驱动器与散热设计)。
  • 逆变器、UPS 与电源管理模块中的开关元件。
  • 通用功率开关、负载切换与过流保护电路。

四、使用建议与注意事项

  • 驱动电压与门极保护:虽在 Vgs = 4.5V 时 RDS(on) 标称较低,但应保证驱动电压在合适范围并避免过冲、负向反向峰值。选择驱动器时需考虑 Qg=16 nC 的开关能量与驱动电流能力。
  • 开关损耗估算:开关损耗与栅极电荷、驱动电压及开关频率相关,近似关系为 Pdrive ≈ Qg × Vdrive × fs。在高频率下需注意驱动功耗与器件发热。
  • 反向恢复与振铃控制:Crss(18 pF)较小,有利于减小米勒效应,但在高 dv/dt 场合仍需设计合适的门极电阻和阻尼网络以控制振铃与过压。
  • 热闭合与可靠性:Pd=81W 为器件在特定散热条件下的最大耗散,实际应用需根据 PCB 温升、铜箔面积与散热条件重新计算结温与安全余量。长期工作温度接近上限时请留足裕度。

五、封装与热管理建议

  • PDFN5060-8L 封装便于高密度组装,但热阻依赖底部散热焊盘与 PCB 铜层。建议:
    • 在 PCB 底部设计大面积的焊盘(thermal pad)并配合多层散热铜箔与通孔(vias)疏导热量至内层或背面散热层。
    • 在高功率应用中增加散热器或底部铜柱连接以提升热流路径。
    • 在方案评估阶段做热仿真(或测量)以校核结温,确保在最大环境温度与最大负载下结温在安全范围内。

六、设计参考与选型建议

  • 若系统采用 5V 左右的逻辑驱动,YJG40G10A 的低 RDS(on) 在效率与成本间具优势;若驱动电压更高(如 10~12V),需关注栅极电压安全极限并衡量更低导通阻抗的价值。
  • 在频率较高的开关设计中,应综合考虑 Qg 与 Ciss 对驱动器功耗与开关损耗的影响,适当增加门极电阻减小电磁干扰与振铃。
  • 对于要求极低导通损耗(如同步整流低压段),可以比较同电压等级下更低 RDS(on) 的器件;对于成本与封装密度敏感的设计,YJG40G10A 在 100V/40A 级别具有良好的性价比。

以上为 YJG40G10A 的产品概述与工程使用参考。实际设计时建议结合完整器件数据手册(包含极限参数、热阻模型、典型特性曲线等)进行电路仿真与热设计验证。若需我方提供电路拓扑或具体布局建议,可告知应用场景与工作条件。

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