WMSIC Electronic Components

YANGJIE SMF12CA

ModelSMF12CA
PackageSOD-123FL
BrandYANGJIE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

13 specifications

Core information

Product name
YANGJIE SMF12CA
Type
SOD-123FL
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YANGJIE
Electronic Component
SMF12CA
Electronic Component
1
Package
SOD-123FL
Electronic Component
0.037g
Electronic Component
1
Electronic Component
BM0229463324
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMF12CA(YANGJIE 扬杰)产品概述

一、产品简介

SMF12CA 是一款双向瞬态抑制二极管(TVS),用于对静电放电(ESD)、浪涌、电气快速瞬变等过压瞬态进行钳制和吸收保护。器件由扬杰(YANGJIE)生产,采用小型 SOD-123 封装,适合对体积、成本有要求的工业及民用电子设备,用于保护单线或差分信号线、电源线及接口电路,确保被保护电路在瞬态冲击下不被损坏。

二、主要电气参数

  • 极性:双向(bi-directional),适用于正负脉冲或交流耦合线路的保护
  • 反向工作电压 Vrwm:12 V
  • 击穿电压 Vbr:14.7 V(典型)
  • 钳位电压 Vc:19.9 V(标准测试条件下)
  • 峰值脉冲电流 Ipp:10.05 A(10/1000 μs 波形)
  • 峰值脉冲功率 Ppp:200 W(10/1000 μs 波形)
  • 反向漏电流 Ir:2.5 μA(在 Vrwm 条件下一般测量值)
  • 工作温度范围:-55 ℃ ~ +150 ℃
  • 类型:TVS(Transient Voltage Suppressor)
  • 封装:SOD-123,便于表面贴装和自动化生产

注:钳位电压与峰值脉冲电流相关,上述 19.9 V 常为在规定脉冲电流条件下的典型钳位值。实际应用中钳位值会随浪涌幅度及环境温度变化。

三、主要特性与优势

  • 双向结构:无需区分极性,适合交流耦合或双向差分信号的保护,使用更灵活。
  • 高吸收能力:在 10/1000 μs 标准测试波形下,器件能承受约 10 A 的峰值冲击电流,能量吸收能力约 200 W(峰值功率),适用于一般的浪涌与感性负载反接场景。
  • 低漏电流:典型反向漏电仅 2.5 μA,适合对静态功耗要求高的系统,降低待机损耗。
  • 宽温度范围:-55 ℃ 至 +150 ℃,满足工业级温度要求,可在严苛环境下稳定工作。
  • 小尺寸封装:SOD-123 具有较小占板面积,利于空间受限的电路板设计与密集布局。

四、典型应用场景

  • 汽车电子:车载信息娱乐、车内通信线(需注意汽车高压脉冲及负载放电规范,做进一步设计验证)
  • 工业通信:RS‑485、CAN、差分信号线及现场总线的浪涌防护
  • 电源输入与配电:12 V 直流供电系统的输入端过压保护
  • 消费类与办公设备:USB、数据接口的过压与静电放电防护(需结合接口具体电压与管脚配置)
  • 基站与电力线路:对抗远程雷击感应的能量吸收(需根据实际雷击能量做级联选择)

五、封装与安装注意事项

  • 封装:SOD-123,适用于自动贴装与回流焊工艺。
  • 焊接工艺:遵循供应商回流温度曲线与焊接建议,避免过热造成封装或焊盘损伤。
  • 布局建议:将 TVS 芯片尽量靠近被保护的接口或进线端放置,以缩短走线长度,减少寄生阻抗与感抗,从而提高钳位效率。
  • 地线与散热:对于高能量吸收场合,优化地平面和散热路径,确保热量能快速传导到 PCB 大地或散热体,避免局部过热。

六、选型与可靠性建议

  • 能量匹配:根据目标系统可能遭受的脉冲能量(幅值、波形、持续时间)选择合适的 Ppp 与 Ipp 等级。10/1000 μs 波形适用于某些浪涌与雷击等间接冲击场合,但对于短脉冲(如 ESD 8/20 μs)或快脉冲(IEC 61000‑4‑2)应核对应的规格或选择联合防护。
  • 串联/并联策略:对极端浪涌场合,考虑多级保护(如先级大能量器件后级快速 TVS)或在多通道并联以分摊能量,但要注意电气均流与封装限制。
  • 环境与寿命:长期暴露在高温、大电流冲击下会加速器件退化,设计时考虑安全系数与冗余。
  • 兼容性验证:在最终应用中进行整机的浪涌与 ESD 测试,验证实际钳位、漏电与热稳定性。

七、典型接法与注意点

  • 双向保护通常直接并联连接在被保护两端(或对地),不区分极性,适合差分线或没有固定极性的信号。
  • 对于电源线保护,TVS 与熔断器、滤波器并用可获得更好的持续抗冲击能力和误动作抑制。
  • 避免将 TVS 直接与敏感模拟输入共地过长走线,以减小干扰注入和接地回路噪声。

八、结论与采购参考

SMF12CA(YANGJIE)凭借 12 V 的工作电压、约 19.9 V 的钳位和在 10/1000 μs 条件下约 10 A 的冲击电流承受能力,适用于多数 12 V 级别电源与信号线的瞬态保护场合。SOD-123 小封装便于紧凑布局,同时工作温度范围与低漏电流特性使其在工业与消费电子中具有较好通用性。最终选型请结合被保护电路的最大允许钳位、实际浪涌波形与能量要求,并以详细器件数据手册为准进行设计与热、冲击验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.