WMSIC Electronic Components

YANGJIE BAS70-04Q BAS70

ModelBAS70-04Q
PackageSOT-23(TO-236)
BrandYANGJIE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

13 specifications

Core information

Product name
YANGJIE BAS70-04Q
Type
SOT-23(TO-236)
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YANGJIE
Electronic Component
BAS70-04Q
Electronic Component
1
Package
SOT-23(TO-236)
Electronic Component
0.033g
Electronic Component
1
Electronic Component
BM0264483416
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

扬杰BAS70-04Q开关二极管产品概述

扬杰科技(YANGJIE)推出的BAS70-04Q是一款高性能表面贴装开关二极管,采用SOT-23(行业内常标注为TO-236)封装,以低正向压降、极低反向漏电流、宽结温范围为核心优势,广泛适用于消费电子、工业控制、通信等领域的信号切换、低功耗整流及静电防护等场景。

一、产品基本信息

  • 品牌:扬杰科技(YANGJIE)
  • 产品类型:高速开关二极管(注:原描述“普通三极管”为表述误差,BAS70系列为二极管产品)
  • 封装形式:SOT-23(TO-236),3引脚表面贴装封装
  • 尺寸规格:符合SOT-23标准(典型尺寸约2.9×1.6×1.1mm),适配高密度PCB布局,大幅减少板级空间占用

二、核心电气参数解析

BAS70-04Q的参数设计针对小电流、低噪声、宽温域场景优化,关键参数如下:

1. 正向导通特性

正向压降(Vf)为1V@15mA,属于低损耗设计——在小电流信号路径中可有效降低导通损耗,提升电路效率,避免信号传输过程中的能量损失。

2. 反向阻断能力

直流反向耐压(Vr)达70V,满足多数低压应用的反向电压阻断需求(如12V/24V系统的信号隔离、电源反向保护),避免反向电流干扰或损坏前端电路。

3. 电流承载能力

  • 持续整流电流:70mA(DC),稳定支撑小电流信号传输或低功耗整流(如电池供电设备的辅助电源);
  • 非重复峰值浪涌电流(Ifsm):3A(非重复脉冲),可耐受电路突发浪涌(如电源上电尖峰、静电放电脉冲),提升系统抗干扰能力。

4. 反向漏电流

反向电流(Ir)仅0.2pA@50V,为业内极低水平——适合对噪声敏感的高精度电路(如模拟信号调理、低功耗传感器接口),大幅减少反向漏电流对信号的干扰。

5. 结温与环境适应性

工作结温范围覆盖**-55℃~+150℃**,可适应工业级高低温环境(如户外设备、车载辅助电路),满足宽温域应用需求。

三、封装与可靠性设计

SOT-23(TO-236)封装具备以下核心优势:

  • 小型化集成:紧凑尺寸适配便携设备、小型化模块的高密度布局,符合电子设备“轻薄化”趋势;
  • 焊接可靠性:表面贴装设计兼容自动化贴装工艺,引脚间距标准(0.95mm),焊接过程易控制,减少虚焊风险;
  • 热性能优化:封装结构利于热量传导,配合宽结温范围,可稳定工作在高温环境下(需注意散热设计,避免局部过热)。

四、典型应用场景

BAS70-04Q的参数特性使其适配多类场景:

  1. 高速信号切换:通信电路、数字逻辑电路中的信号选通(如多路复用器、HDMI接口切换),低压降确保信号传输损耗小;
  2. 低功耗整流:小电流电源整流(如LED小夜灯、智能手环辅助电源),70mA持续电流满足低功耗需求;
  3. 信号钳位与ESD防护:作为信号端口钳位二极管,防止过冲;极低漏电流可兼做轻度ESD防护,保护敏感电路;
  4. 模拟电路接口:传感器接口、电平转换电路中的偏置控制,避免反向漏电流干扰模拟信号;
  5. 工业控制电路:宽温域适配工业现场(如PLC输入输出接口、温度传感器电路),稳定应对高低温变化。

五、选型与使用注意事项

  1. 电流容量匹配:持续工作电流≤70mA,非重复浪涌电流≤3A,避免长期过流导致性能下降;
  2. 电压降考量:1V正向压降在低电源电压(如3.3V)电路中需注意对输出电平的影响;
  3. 温度降额:环境温度接近150℃时,每升高1℃需降额约0.5%工作电流,确保结温不超额定值;
  4. 焊接工艺:回流焊峰值温度≤260℃(时间≤10秒),避免过热损坏器件;
  5. 反向偏置使用:长期反向偏置时,反向电压需≤70V,利用极低漏电流特性适配信号保持电路。

总结

BAS70-04Q凭借低损耗、低噪声、宽温域、小型化的综合优势,成为小电流开关/整流场景的高性价比选择,覆盖从消费电子到工业控制的多领域应用,是设计紧凑、低功耗电路的理想器件。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.