WMSIC Electronic Components

YANGJIE YJS2301A

ModelYJS2301A
PackageSOT-23-6L
BrandYANGJIE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

13 specifications

Core information

Product name
YANGJIE YJS2301A
Type
SOT-23-6L
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YANGJIE
Electronic Component
YJS2301A
Electronic Component
1
Package
SOT-23-6L
Electronic Component
0.038g
Electronic Component
1
Electronic Component
BM0227778286
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

YJS2301A 产品概述

一、产品简介

YJS2301A 是扬杰(YANGJIE)推出的一款双一路P沟道功率场效应管,封装为 SOT-23-6L,面向便携式与低压电源管理场景。器件额定漏源电压为 20V,单通道连续漏极电流可达 3.7A(须结合散热条件),导通电阻低至 49mΩ(VGS=−4.5V、ID=3.4A),适合高侧开关、负载切换和电源路径管理等应用。

二、主要规格与特性

  • 器件类型:双 P 沟道 MOSFET(2×P-channel)
  • 封装:SOT-23-6L(小体积、适合表贴)
  • Vdss(漏源耐压):20V
  • Id(连续漏极电流):3.7A(单通道,受散热限制)
  • RDS(on):49mΩ @ VGS = −4.5V, ID = 3.4A
  • VGS(th)(门限电压):620mV(典型)
  • 总栅极电荷 Qg:4.3nC @ VGS = 4.5V
  • 输入电容 Ciss:550pF @ 10V
  • 反向传输电容 Crss(Cgs/Cgd 相关):65pF @ 10V
  • 输出电容 Coss:89pF
  • 功耗 Pd(最大耗散):1.3W(在规定热阻和环境下)
  • 工作结温范围:-55℃ ~ +150℃(Tj)

这些参数表明器件在低压(≤20V)高侧开关场景下具有较好的导通性能与开关特性,同时保持小封装优势。

三、典型应用场景

  • 移动设备电源路径控制(电池到负载的高侧开关)
  • 电池管理系统中的断开/保护电路(反向保护、反接保护)
  • USB/底板供电切换与负载开关
  • 小功率 DC-DC 转换器中作为高侧 MOSFET(需注意开关损耗)
  • 多通道电源分配与热插拔保护

四、使用建议与电路要点

  • 高侧开关:P沟道便于将源端接至电池正极,通过把栅极拉低进行导通,拉高到源电位关闭。设计中应增加上拉电阻以确保断电时关断。
  • 门极驱动:Qg = 4.3nC、Ciss ≈ 550pF,驱动器或 MCU 输出驱动能力需匹配以控制开关速度和开关损耗。若采用较快开关,可在栅极串联少量阻值以抑制振铃与限流。
  • 热设计:Pd = 1.3W 表明在 SOT-23-6L 封装下热限较严格。连续高电流场合需优化 PCB 散热(加铜厚、扩散热铜箔或多层过孔传热),并考虑结温上升对 RDS(on) 的影响。
  • 并联与通道选择:封装内含两路 P 沟道,可并联使用以降低总体 RDS(on) 或用于独立通道实现多路控制。并联时应确保布局对称以避免电流不均。
  • 开关瞬态:Crss(65pF)决定了米勒效应,开关过程中米勒电压可能影响栅极电平,需在驱动设计中考虑过渡过程的稳定性。

五、封装与选购提示

  • SOT-23-6L 小型化封装适合空间受限产品,但对热耗散能力有限,选型时需权衡体积与散热需求。
  • 型号:YJS2301A,品牌:YANGJIE(扬杰)。如需批量采购,建议同时确认器件的批次一致性与封装指示,必要时获取器件数据手册与可靠性测试报告。
  • 设计验证:在原型测试中应测量实际 PCB 上的 RDS(on)、结温与开关损耗,以确定是否需要并联或更换更大封装器件。

总结:YJS2301A 以其 20V 耐压、低 RDS(on) 与双通道集成特性,适合低压高侧开关与电源管理应用。合理的驱动设计与 PCB 散热布局是发挥其性能的关键。若需具体电路图或布局建议,可提供应用场景以便给出更针对性的设计指导。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.