WMSIC Electronic Components

CJ CJL2301

ModelCJL2301
PackageSOT-23-6L
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ CJL2301
Type
CJ
Minimum package
3000

Technical parameters

Electronic Component
CJ
Electronic Component
CJL2301
Electronic Component
1
Package
SOT-23-6L
Electronic Component
2 P
Electronic Component
MOSFET
Electronic Component
0.041g
Electronic Component
1
Electronic Component
BM0228272810
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
350mW
Electronic Component
3000
Voltage(Vdss)
20V
Capacitor(Ciss)
405pF
Resistor(RDS(on))
90mΩ@4.5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CJL2301 产品概述

一、产品简介

CJL2301 是江苏长电/长晶(CJ)出品的双路 P 沟道场效应管,封装为 SOT-23-6L,面向低压高侧开关与功率路径管理场景。每路器件的最大漏源电压为 20V,连续漏极电流 2.3A,导通电阻 RDS(on) 在 VGS=4.5V 时典型为 90mΩ。器件单个功耗标称为 350mW,工作温度范围宽(-55℃ ~ +150℃),适合便携与嵌入式系统的电源管理应用。

二、关键电气参数

  • 漏源电压(Vdss):20V,适用于低压至中低压系统。
  • 连续漏极电流(Id):2.3A,满足一般负载开关及保护需求。
  • 导通电阻(RDS(on)):90mΩ @ VGS=4.5V,低阻抗有利于降低导通损耗。
  • 阈值电压(VGS(th)):约 0.4V,属于低阈值器件,有利于在较低驱动电压下导通。
  • 栅极电荷(Qg):5.5nC @4.5V,栅驱动能量适中,开关损耗受此项影响。
  • 输入电容(Ciss):405pF,反向传输电容(Crss):55pF,影响开关过渡过程与死区设计。
  • 功耗与温度:单器件耗散功率 350mW,工作温度 -55℃ ~ +150℃。

三、典型应用场景

  • 电池管理与电源路径选择(高侧开关)
  • 负载开关、反向电流阻断与电源切换
  • 便携设备、移动终端和低压DC-DC前端保护
  • 低压大电流模拟开关与互补MOSFET配合使用

四、驱动与布局建议

  • 作为 P 沟道高侧开关时,源极通常接近电源正轨,栅极需被拉至高电平以关断;在驱通时需将栅极拉低,VGS=4.5V 可获得标称 RDS(on)。
  • 5.5nC 的总栅极电荷要求适配合适的驱动器,若驱动能力不足会增加开关损耗与上升/下降时间。
  • SOT-23-6L 封装散热受限,建议在 PCB 上使用大面积铜箔扩散热量并缩短高流电流回路的走线长度,以降低局部温升。
  • 输入/输出引脚布局要尽量减小回路面积以降低寄生电感和电磁干扰。

五、使用注意事项

  • 请参考完整数据手册确认最大 VGS 与极限参数,避免超出栅源电压和功耗极限。
  • 在高频开关或并联使用时注意热均衡与电流分配,SOT-23-6L 的热阻限制并联效果。
  • Crss 与 Ciss 会影响开关过渡中的电压应力与功耗,设计驱动与补偿网络时应予以考虑。

六、选用建议

CJL2301 适合需要低到中等电阻、低压高侧开关和双通道集成的应用;若系统需更高电流或更低导通损耗,应考虑更大封装或并联器件。选型时应综合考量导通损耗、开关损耗、封装散热能力及实际工作电压/电流曲线,并参照厂方完整规格书以保证可靠性。

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