WMSIC Electronic Components

YANGJIE M7F

ModelM7F
PackageSMAF(DO-214AD)
BrandYANGJIE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

13 specifications

Core information

Product name
YANGJIE M7F
Type
SMAF(DO-214AD)
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YANGJIE
Electronic Component
M7F
Electronic Component
1
Package
SMAF(DO-214AD)
Electronic Component
0.063g
Electronic Component
1
Electronic Component
BM0229283405
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

M7F 通用整流二极管(YANGJIE 扬杰)产品概述

一、产品简介

M7F 是扬杰(YANGJIE)推出的一款独立式通用整流二极管,封装为 SMAF,面向通用电源整流与反向保护应用。该器件在 1A 工作电流下表现出约 1.1V 的正向压降,具备高达 1kV 的直流反向耐压和极低的反向漏电流(5 μA@1kV),同时可承受短时 30A 的非重复峰值浪涌电流。工作结温范围宽(-55℃ 到 +150℃),适合苛刻环境下的长期使用。

二、主要电气与热特性

  • 器件类型:独立式整流二极管(SMAF 封装)
  • 正向压降(Vf):1.1 V @ If = 1 A(典型工况)
  • 额定整流电流(Io):1 A(连续)
  • 直流反向耐压(Vr):1000 V
  • 反向电流(Ir):5 μA @ Vr = 1000 V
  • 非重复峰值浪涌电流(Ifsm):30 A(短时脉冲)
  • 工作结温范围:-55 ℃ 至 +150 ℃

这些参数表明 M7F 在高耐压场合下能提供可靠的整流能力,并在需要应对瞬态冲击电流时具备一定的鲁棒性。较低的反向漏电流有利于高压系统降低待机损耗与热升。

三、典型应用场景

  • 高压整流电源:用于桥式整流或单路整流,适合工业级或家电类高压输入的电源模块。
  • 开关电源(SMPS)初级整流:在输入滤波与功率级中作为高耐压通用整流器使用。
  • 交流/直流适配器、充电器:对高耐压与低漏电有要求的外围整流应用。
  • 保护电路与反向保护:用于防止电源反接或作为钳位元件。
  • 工业设备与照明电源:对耐压、温度范围有较高要求的场景。

四、设计与使用建议

  • 热管理:尽管器件额定工作结温可达 +150 ℃,长期连续使用时应控制器件结温在安全范围内以延长寿命。设计 PCB 时建议提供足够的铜面积作为散热路径,并尽量缩短主流路径以降低热损耗。
  • 浪涌与保护:Ifsm 为 30 A(非重复短时脉冲),适合吸收启动或瞬态冲击,但不宜长期将浪涌作为常态工作方式。若系统存在重复大电流冲击,建议选用专门的浪涌抑制器或更高 Ifsm 规格的器件。
  • 反向电压裕量:器件 Vr = 1000 V,实际设计中应考虑电压峰值、浪涌及负载波动,留有安全裕量以避免应力过高导致击穿。
  • PCB 布局:保证正负极的走线宽且短,减少寄生电感和电阻;高压部分应保持足够的爬电距离与绝缘,防止表面或空气间穿越引发闪络。
  • 可靠性检测:在批量应用前,建议在目标环境下验证 Vf、Ir 随温度变化的特性,尤其是高温与高压联合工况下的漏电与热稳定性。

五、封装与焊接注意

  • 封装类型:SMAF,利于表面贴装工艺(SMT),适合自动化生产线。
  • 焊接工艺:遵循通用 SMT 回流焊工艺规范,避免过高峰值回流温度或长时间高温,防止封装应力和内部金属互扩散。若需手工焊接,应控制焊枪温度与时长,避免对器件产生热损伤。
  • 储存与搬运:按常规半导体器件防潮、防静电要求处理;若器件经过潮湿敏感处理(MSL)要求,应在规定时间内回流焊接。

六、选型与替代建议

M7F 适合需要 1A 连续整流、1kV 反向耐压以及低漏电的通用场合。若系统需要更低正向压降、更高连续电流或更强浪涌承受能力,可考虑更大封装或专用肖特基/快恢复二极管方案;若对正向压降容忍度高但要求更高耐压或更低漏电,也可在同一系列中比较其他型号以找到更合适的平衡点。

七、总结

M7F(扬杰)是一款面向高压通用整流场景的可靠选择,兼具高耐压(1kV)、低反向漏电(5 μA@1kV)与适度的浪涌承受能力(30 A 短时),并提供宽温工作范围(-55℃ 至 +150℃)。在设计时合理布板、做好热管理并考虑浪涌与电压裕量,可充分发挥该器件在电源整流与保护中的性能与稳定性。若需器件详细数据表或在特殊工况下的仿真建议,可提供进一步的电气测试与应用支持。

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