Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
YANGJIE SL54F
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
13
specifications
Core information
- Product name
- YANGJIE SL54F
- Type
- SMAF(DO-214AD)
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YANGJIE
- Electronic Component
- SL54F
- Electronic Component
- 1
- Package
- SMAF(DO-214AD)
- Electronic Component
- 0.064g
- Electronic Component
- 1
- Electronic Component
- BM0228747242
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SL54F 肖特基二极管（YANGJIE 扬杰）产品概述
一、产品简介
SL54F 是扬杰（YANGJIE）推出的一款独立式肖特基整流二极管，封装为 SMAF（DO-214AD），适用于中功率整流与保护场合。主要电气参数包括：正向压降 Vf = 0.45V（@5A），直流整流电流 Io = 5A，直流反向耐压 Vr = 40V，反向漏电流 Ir = 500µA（@40V），非重复峰值浪涌电流 Ifsm = 100A，允许工作结温范围 -55℃ 至 +150℃。
二、主要特点
- 低正向压降：Vf≈450mV（5A）可显著降低导通损耗，适合要求高效率的整流与续流场合。
- 良好浪涌能力：100A 峰值浪涌电流支持短时启动电流与突发负载。
- 中等反向耐压：40V 适用于常见的5V/12V/24V系统及电源拓扑。
- 封装可靠：SMAF（DO-214AD）为表面贴装大功率封装，便于 PCB 热设计与自动化贴装。
三、典型应用场景
- 开关电源（SMPS）输出整流、同步整流替代或续流二极管；
- 直流-直流转换器、降压模块输出侧；
- 逆接反保护与电池管理；
- LED 驱动、电机驱动及一般功率整流场合。
四、性能与可靠性要点
- 反向漏电随温度上升而显著增加，低功耗待机电路需评估 500µA@40V 在工作温度下的影响；
- 长时间大电流工作时应注意 PCB 散热设计，利用宽铜箔或散热槽降低结温；
- 封装与焊接应遵循厂家工艺建议，避免超过最大结温以保证寿命与可靠性。
五、选型与使用建议
- 若系统对待机漏电严格要求，应考虑低漏电肖特基或增加并联/串联方案；
- 计算导通损耗时以 Vf@实际工作电流为准，并考虑温度系数带来的 Vf 变化；
- 在高浪涌或反复冲击场景，评估 Ifsm 与重复冲击能力，必要时使用更高浪涌能力器件或增加软启动保护。
六、封装与安装提示
SMAF（DO-214AD）为通用高功率 SMD 封装，焊接方便且热阻较低。推荐在焊盘处提供足够铜面积和过孔连至散热层，确保结温控制在安全范围内并利于长期稳定工作。
七、技术验收与资料
采购或应用前建议获取完整数据手册进行详细验证，关注温度特性曲线、瞬态热阻、典型 V‑I 曲线及推荐焊接温度曲线。SL54F 适用于多数中功率整流与保护应用，但在极低漏电或高耐压场合需选用更合适型号。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
