WMSIC Electronic Components

YANGJIE YJL3415KC

ModelYJL3415KC
PackageSOT-23(TO-236)
BrandYANGJIE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

13 specifications

Core information

Product name
YANGJIE YJL3415KC
Type
SOT-23(TO-236)
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YANGJIE
Electronic Component
YJL3415KC
Electronic Component
1
Package
SOT-23(TO-236)
Electronic Component
0.045g
Electronic Component
1
Electronic Component
BM0262713925
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

YJL3415KC 产品概述

一、产品简介

YJL3415KC 是扬杰(YANGJIE)推出的一款 P 通道 MOSFET,封装为 SOT-23(TO-236)。器件适用于低电压电源高端开关、负载开关与电源路径控制等场景。主要规格:漏源电压 Vdss = 20V,连续漏极电流 Id = 5A,导通电阻 RDS(on) = 70mΩ(VGS = -2.5V 测试条件),耗散功率 Pd = 1W。

二、关键电气参数

  • Vdss:20V,适合 5V/12V 低压系统的高端开关应用。
  • Id:5A 连续电流能力(注意受封装及 PCB 散热限制)。
  • RDS(on):70mΩ @ VGS = -2.5V,表示在较低栅压下即可实现较低导通损耗,利于逻辑电平驱动。
  • Vgs(th):1.25V @ 250µA,为开启阈值参考值。
  • Qg:13nC @ 10V,栅极电荷适中,影响驱动器选择与开关损耗。
  • Ciss/Coss/Crss:540pF / 120pF / 100pF,影响开关速度与电磁干扰特性。

三、主要特性与优势

  • 逻辑电平可驱:在较小负栅压下(如 -2.5V)即可获得良好导通电阻,便于与 MCU 或 PMIC 直接配合。
  • 小封装、高集成度:SOT-23 体积小、适合移动设备与空间受限的电路板布局。
  • 平衡的开关与导通性能:中等 Qg 与 Ciss 在开关频率与驱动功耗之间取得折中,适合多数开关场合。

四、典型应用场景

  • 低压设备的高端负载开关(如 5V/3.3V 电源管理)。
  • 电池供电系统的电源路径控制与反向保护。
  • 便携式电子、消费类电子、单板电路的断电控制与电源切换。

五、布局与使用建议

  • 散热:Pd 标称 1W,SOT-23 封装散热依赖 PCB 铜箔,建议加大热沉铜面积并采用短而粗的走线。
  • 驱动:推荐保证栅极驱动能提供足够的负向电压以达到目标 RDS(on),并考虑驱动器输出电流以快速充放栅电荷(Qg = 13nC)。
  • 布线:将源极、漏极的电流回路尽量缩短,靠近电容做去耦,减少寄生电感。
  • 保护:对感性负载需考虑体二极管的恢复损耗,可并联或选择合适的缓冲方案。

六、选型注意事项

尽管器件标称 5A,但在实际应用中应以 PCB 散热条件与环境温度决定可持续电流。若工作在较高开关频率或驱动电压不充分时,应关注开关损耗与热升。对于需要更低 RDS(on) 或更高 Vdss 的应用,可考虑尺寸更大或不同系列的 MOSFET。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.