WMSIC Electronic Components

YANGJIE BCX56-16 BCX56

ModelBCX56-16
PackageSOT-89
BrandYANGJIE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YANGJIE BCX56-16
Type
SOT-89
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YANGJIE
Electronic Component
BCX56-16
Electronic Component
1
Package
SOT-89
Electronic Component
0.13g
Electronic Component
1
Electronic Component
BM0229283413
Electronic Component
Electronic Component
Electronic Component
1000
models
BCX56-16
version
1
prompt_id
15
package_id
45
image_model
gpt-image-2.5-flare
master_path
chengming/packages/45/cm-master-zh/2d8a1d2d0caa2d543fbb7b7e1dc93ed75e287e590685922a766d08f03c1477e0.png

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BCX56-16 产品概述

一、概述

BCX56-16 为 NPN 小功率晶体管,属于通用放大与开关用途的器件。由品牌 YANGJIE(扬杰)供应,器件在中低功率区间具有较高的直流电流增益与较快的频率特性,适用于信号放大、驱动与开关等多种电子电路场景。封装信息未明确,使用前请以供应商正式数据手册为准。

二、主要电气参数

  • 晶体管类型:NPN
  • 集电极电流 Ic:1 A(最大)
  • 集—射极击穿电压 Vceo:80 V
  • 最大耗散功率 Pd:500 mW(在规定测试条件下)
  • 直流电流增益 hFE:250(测量条件 Ic=150 mA,VCE=2 V)
  • 特征频率 fT:130 MHz(表征高频放大能力)
  • 集电极截止电流 Icbo:100 nA(低漏电流特性)
  • 集射极饱和电压 VCE(sat):典型 0.5 V(标注条件为 500 mA 与 50 mA)
  • 射—基极击穿电压 Vebo:5 V(请注意反向基射电压限制)
  • 工作温度范围:-55 ℃ ~ +150 ℃

三、性能解读与设计提示

  • 增益与线性:在 Ic=150 mA、VCE=2 V 条件下 hFE≈250,表明在中等电流下具有较高放大倍数,适合小信号到中功率放大电路。用于高精度放大时应考虑 hFE 的散差与温度依赖性。
  • 频率特性:fT≈130 MHz,可用于音频至射频前端的中高频放大,但高频设计仍需良好阻抗匹配与布局控制。
  • 开关与饱和:VCE(sat)≈0.5 V(在指定测试点),作为开关使用时可获得较低的导通压降,但要注意饱和状态下基极驱动电流应足够(一般按 Ic/10~Ic/20 估算基极电流以确保充分饱和)。
  • 热与功耗管理:最大耗散功率 500 mW,功耗计算须满足 P = VCE × IC ≤ Pd,并随结温上升按厂商给出的降额曲线进行温度降额。若持续较大电流或高 VCE,应采取散热措施或降低占空比。
  • 可靠性注意:Icbo 仅 100 nA 表明器件漏电流低,适合低漏电流需求电路;但 Vebo=5 V 提示不得对基—射极施加过大的反向电压,以免损坏器件。

四、典型应用场景

  • 小信号与中功率放大器(音频前级、驱动级)
  • 低压开关与负载驱动(继电器驱动、指示灯驱动,但需留意基极驱动能力与功耗)
  • 接口缓冲与电平转换
  • 高频放大前端或射频混合电路的中频级(受限于封装与布局)

五、封装与选型建议

封装未标明,选型时应确认实际产品的封装形式(SOT-23、TO-92、SOT-223 等)与热阻、引脚排列。若用于接近最大 Ic 或长时间功耗较高的场合,请优先选择热阻更低、散热良好的封装或使用 PCB 散热设计。选型时同时核对厂方完整数据手册中的典型特性曲线、最大额定值与 SOA(安全工作区)。

六、使用与防护建议

  • 驱动设计:保证基极电流充足以满足开关或饱和要求,并加上限流或基极保护电阻。
  • 反向保护:避免对 BE 结施加超过 Vebo 的反向电压,可在必要处并联二极管以保护基—射结。
  • 温度降额:高环境温度下应按数据手册降额使用,避免长时间在极限功耗下工作。
  • 验证与替代:在批量替换或设计更新时,应以厂家提供的最新数据手册为准,封装与引脚定义须经实物核对。

总结:BCX56-16 为一款面向通用放大与低中功率开关的 NPN 晶体管,兼顾较高增益与良好频率响应。设计中重点关注功率与热管理、基极驱动及反向电压保护,可在多种消费电子与工业控制场合中发挥作用。

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