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Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ALLEGRO A5979GLPTR-T A5979GLPTR
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ALLEGRO A5979GLPTR-T
- Type
- ALLEGRO
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ALLEGRO
- Electronic Component
- A5979GLPTR-T
- Electronic Component
- 1
- Package
- TSSOP-28-EP
- Electronic Component
- Stepper Motor Driver IC
- Electronic Component
- 0.299g
- Electronic Component
- 1
- H
- 2
- Features
- Built-in Charge Pump;; positions; /; Motor
- Electronic Component
- BM0257712306
- Resistor
- 370mΩ
- Operating Temperature
- 40℃~+105℃
- Interface Type
- STEP/DIR
- Voltage
- 3V~5.5V
- Electronic Component
- 16
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
A5979GLPTR-T 产品概述
一、概述
A5979GLPTR-T 为美国 ALLEGRO（埃戈罗）推出的双极性步进电机驱动器，集成 DMOS H 桥和逻辑控制功能，封装为 TSSOP-28 带散热焊盘（EP）。器件支持 1/16 步细分（步长细分:16），工作温度范围为 -40℃ 至 +105℃，适合工业级和消费级的高可靠性运动控制场景。
二、主要特性
- 内置双极 DMOS 输出级，驱动两相步进电机（A/B 线圈）；电流采用闭环/开环电流调节（电流斩波）方式实现限流。
- 支持最大 1/16 微步细分，通过逻辑引脚设置，实现平滑运动和低振动。
- 逻辑电平控制接口（常见 STEP/ DIR/ ENABLE/ SLEEP 等），便于与 MCU 集成。
- 多重保护：过流保护、过温关断、欠压锁定及死区管理等（提高系统可靠性）。
- TSSOP-28-EP 封装带底部散热焊盘，有利于热量传导与 PCB 散热设计；提供卷带包装（-T 后缀）。
三、典型应用
- 打印设备、扫描仪、光学对位与相机模组的精密定位。
- 3D 打印、纺织、微型泵与医疗检测设备等需要细分控制的场合。
- 运动控制、电机驱动模块及机器人关节与定位机构。
四、电气与热设计要点
为确保稳定与可靠，建议：
- 在电源端使用低 ESR 去耦电容并靠近 VBB 引脚布置；在电机供电线上考虑 TVS 或滤波抑制反向尖峰。
- 电流检测电阻（Rsense）布置尽量靠近芯片的感测引脚，走短线与粗铜。
- 底部散热焊盘（EP）应焊实至地铜或散热层并配合多通孔（thermal vias）向内层扩散热量。
- 输出走线尽量短且对称，电机导线采用双绞并加屏蔽以减少 EMI。
五、封装与订购信息
器件采用 TSSOP-28 带底部散热焊盘，适合 SMT 组装与批量生产。型号后缀通常表明环保/封装与供应形式（如卷带供货 -T），具体请以厂商资料和货单为准。
六、评估与注意事项
在评估板或系统集成时，应参考 ALLEGRO 的参考电路与 PCB 推荐布局，验证热稳态下的电流限制与保护动作。对于高电流或高频应用，重点检查散热与滤波设计以避免热关断或电磁干扰。若需更详细的电气参数、引脚定义与典型应用电路，请参阅官方数据手册或联系授权分销商获得样片与评估板。
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