WMSIC Electronic Components

AOTE TLP185GB-S TLP185GB

ModelTLP185GB-S
PackageSMD-4P
BrandAOTE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
AOTE TLP185GB-S
Type
SMD-4P
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
AOTE
Electronic Component
TLP185GB-S
Electronic Component
1
Package
SMD-4P
Electronic Component
Transistor Output Optocoupler
Electronic Component
0.217g
Electronic Component
1
Electronic Component
3us
Electronic Component
BM0229305972
Operating Temperature
55℃~+110℃
Load Voltage
80V
Type
DC
Output Current
50mA
Output Type
Photoelectric Transistor
Output Channel Count
1

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TLP185GB-S 光耦(光电晶体管输出)产品概述

一、产品简介

TLP185GB-S 是 AOTE(奥特)出品的一款单通道光电晶体管输出光耦,封装为 SOP-4(SMD-4P)。器件通过发光二极管驱动内部光电晶体管,实现输入与输出之间的电气隔离,广泛用于信号隔离、逻辑接口和电源控制等场合。该型号侧重于高隔离电压与较宽的工作温度范围,适合工业和通信类应用。

二、主要特性

  • 隔离电压高:Vrms 5 kV,保证输入与输出之间的可靠绝缘隔离。
  • 宽输运比范围:CTR 最小值 80%,最大/饱和值可达 600%,适用不同增益需求。
  • 低饱和压降:VCE(sat) ~100 mV(典型),有利于降低导通损耗。
  • 较高输出能力:可承受输出电流至 50 mA,负载电压最高 80 V。
  • 响应性能:上升时间 tr ≈ 12 μs,下降时间 tf ≈ 3 μs,满足多数通用开关速度要求。
  • 宽温度范围:工作温度 -55℃~+110℃,适应恶劣环境。

三、关键参数(概要)

  • 隔离电压:5 kVrms
  • 输入类型:DC(发光二极管)
  • 正向压降 Vf:1.4 V
  • 直流反向耐压 Vr:6 V
  • 正向电流 If:50 mA(最大)
  • 输出类型:光电三极管
  • 输出电流:50 mA
  • 负载电压:80 V
  • 电流传输比 CTR:最小 80%,最大/饱和值 600%
  • 集-射极饱和电压 VCE(sat):100 mV(给定条件下)
  • 上升/下降时间:tr 12 μs / tf 3 μs
  • 输出通道数:1

四、封装与环境

  • 封装形式:SOP-4(SMD-4P),利于表面贴装自动化生产。
  • 品牌:AOTE(奥特)。
  • 工作温度范围:-55℃ 至 +110℃,适合工业级应用场景。

五、典型应用

适用于开关隔离、继电器驱动前端、MCU 与高电压电路之间的信号隔离、电源管理和通信接口隔离等。尤其适合需要高隔离等级、较大输出驱动能力及宽温度适应性的场合。

六、设计与使用建议

  • 输入侧驱动时注意 Vf 与 If 限制,宜配合合适限流电阻以保护 LED。
  • 输出端在高电流或高负载电压工作时,应关注散热与电路保护(如限流或吸收元件)。
  • 在系统符合 EMC 与安全规范的设计中,可利用其 5 kVrms 隔离能力提升整体抗扰度与人员安全。
  • 由于 CTR 具有较大变化范围,设计时应考虑最小 CTR 条件下的驱动裕量,或在需要精确增益时做标定/选型。

总结:TLP185GB-S 为一款性能均衡的光电晶体管光耦器件,适合工业与通信等需要高隔离与稳健驱动能力的应用场景。若需更详细的典型电路图或具体测试条件,建议参阅厂商数据手册或联系供应商获取完整规范。

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