WMSIC Electronic Components

BLUE ROCKET MB10F

ModelMB10F
PackageMBF
BrandBLUE ROCKET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BLUE ROCKET MB10F
Type
BLUE ROCKET
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BLUE ROCKET
Electronic Component
MB10F
Electronic Component
1
Package
MBF
Type
Electronic Component
Electronic Component
Bridge Rectifier
Electronic Component
0.2g
Electronic Component
1
Electronic Component
BM0231133050
Current
1A
Current(Ir)
5uA@1kV
(Vf)
1V@500mA
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MB10F 产品概述 — BLUE ROCKET(MBF 封装)

一、产品简介

MB10F 为 BLUE ROCKET 出品的单相整流桥,封装为 MBF,适用于小功率直流电源与高压整流场合。器件设计紧凑、耐压高、漏电流低,常用于需要在有限空间内实现全波整流的电路。

二、主要参数

  • 正向压降 (Vf):1.0 V @ 500 mA(典型值)
  • 直流反向耐压 (Vr):1000 V
  • 整流电流 (Io):1 A(连续平均)
  • 反向电流 (Ir):5 μA @ 1000 V
  • 非重复峰值浪涌电流 (Ifsm):35 A
  • 工作结温范围:-55 ℃ ~ +150 ℃
  • 类型:单相整流桥
  • 封装:MBF
  • 品牌:BLUE ROCKET

三、性能要点与优势

  • 高耐压:1000 V 反向耐压满足高压整流需求,可直接用于高电压二次侧或直流母线的整流。
  • 低泄漏:5 μA@1kV 的低反向电流,有利于高阻抗或精密测量电路中降低漏电影响。
  • 良好冲击承受能力:35 A 的峰值浪涌电流可应对整流时的充电冲击或短时过载。
  • 宽温度范围:-55~150 ℃ 的工作结温,适合工业及恶劣环境应用。

四、典型应用场景

  • 小功率开关电源和线性电源的整流输出
  • 高压测量、传感与测试设备的直流供电
  • 小型充电器、照明驱动、工业控制模块
  • 需要低漏电流的监测电路或高阻抗输入电路

五、设计与使用建议

  • 热管理:虽然连续整流电流为1 A,但高结温下正向压降和损耗会增加。建议在高载流或高环境温度下采取良好散热措施,并进行适当降额。
  • 冲击电流与电容充放电:Ifsm=35 A 能承受短时充电浪涌,但在连接大容量滤波电容时仍应采用限流或软启动电路以延长器件寿命。
  • 绝缘与爬电距离:1 kV 耐压要求在 PCB 设计时留足爬电距离与绝缘间隙,特别是交流输入与直流输出之间的隔离。
  • 高频噪声与抑制:整流后并联电容会产生浪涌电流,必要时配合NTC、限流电阻或RC吸收网络,降低电气应力。
  • 可靠性注意:高压环境下反向漏流随温度迅速上升,长期在高温高压工况下工作时需评估漏电及热循环影响。

六、封装与焊接提示

MBF 封装体积小,便于自动贴装。焊接时遵循常规焊料与回流曲线,避免过高温度和长时间热应力,以免影响封装可靠性。储存与搬运时注意静电防护与防潮措施。

七、选型与替换提示

在替换或选型时,应关注连续电流、峰值浪涌、反向漏电与耐压三项关键参数。若系统有更高电流需求或更严苛热环境,建议选择额定电流更高或带热沉方案的整流器件。

如需完整数据手册、封装尺寸或样片支持,可进一步提供用途与电路参数,以便给出更具体的选型与应用建议。

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