WMSIC Electronic Components

BLUE ROCKET BAT54C

ModelBAT54C
PackageSOT-23
BrandBLUE ROCKET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BLUE ROCKET BAT54C
Type
BLUE ROCKET
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BLUE ROCKET
Electronic Component
BAT54C
Electronic Component
1
Package
SOT-23
Electronic Component
Schottky Diode
Electronic Component
0.031g
Electronic Component
1
Electronic Component
BM0233262416
Current
200mA
Diode
1
Current(Ir)
2uA@25V
(Vf)
800mV@100mA
Electronic Component
Electronic Component
Electronic Component
3000
Voltage Rating(Vr)
30V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BAT54C 产品概述

一、产品简介

BAT54C(BLUE ROCKET 品牌)是一款双二极管共阴极肖特基二极管,采用SOT-23小型封装,面向低功耗、快速开关和保护电路。器件集成一对共阴极肖特基结构,具有低正向压降、低反向漏电流以及良好的浪涌承受能力,适合移动设备、电源管理和接口保护等领域。

二、主要特性

  • 1对共阴极(双二极管,阴极相连)。
  • 正向压降 Vf = 0.8 V @ 100 mA(典型工作点)。
  • 直流反向耐压 Vr = 30 V。
  • 正向整流电流 If = 200 mA(连续工作极限)。
  • 非重复峰值浪涌电流 Ifsm = 600 mA(单次冲击)。
  • 反向漏电流 Ir = 2 μA @ 25 V(低漏电特性,有利于待机功耗控制)。
  • 峰值功耗 Pd = 290 mW。
  • 结电容 Ct ≈ 10 pF(利于高频响应)。
  • 等效反向恢复时间 Trr ≈ 5 ns(快速开关性能)。

三、电气参数汇总

  • 极限参数:Vr 30 V,If 200 mA(直流),Ifsm 600 mA(非重复峰值)。
  • 典型/小信号行为:Vf 在中等电流时约 0.8 V,有利于减小压降与功耗。
  • 漏电与频率响应:Ir 仅 2 μA@25 V,Ct 约 10 pF,Trr 约 5 ns,适合高频开关与保护场景。

四、典型应用

  • 电源路径整流与反向极性保护(小电流场合)。
  • 快速切换和整流电路(如采样、混合信号电路的钳位/导通)。
  • 接口保护(信号线钳位、ESD 协助保护的二次保护)。
  • 电池供电设备与便携终端的低损耗整流与保护。

五、封装与热管理

BAT54C 使用 SOT-23 封装,体积小、易于贴片生产。由于器件最大功耗 Pd ≈ 290 mW 且 If = 200 mA,需注意 PCB 热设计:

  • 在高电流或连续导通场合,增大焊盘铜面积以利散热;
  • 尽量缩短引线长度、采用短宽走线降低热阻;
  • 对于反复冲击电流,应保证 Ifsm 与 PCB 以及系统热容匹配。

六、选型与使用注意事项

  • 若工作电流长期接近或超过 100 mA,应评估 Vf 导致的功耗及温升,必要时选用更高功率封装或并联器件。
  • 对于高工作电压或高温环境,关注 Ir 随温度上升的变化;在高温下漏电可能会增大。
  • Ifsm 为非重复峰值,不能作为连续冲击电流规格使用;若存在频繁浪涌,应选择更高峰值能力的器件或增加限流保护。
  • SOT-23 封装在焊接与回流过程中注意温度曲线,避免过热影响可靠性。

总结:BLUE ROCKET BAT54C 在小型化、低压降与快速切换方面具有良好表现,适合用于低电流整流、保护与高频钳位等应用。正确的PCB布局与热处理能有效提升其长期可靠性与性能。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.