WMSIC Electronic Components

BLUE ROCKET BAT54S

ModelBAT54S
PackageSOT23
BrandBLUE ROCKET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BLUE ROCKET BAT54S
Type
BLUE ROCKET
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BLUE ROCKET
Electronic Component
BAT54S
Electronic Component
1
Package
SOT23
Electronic Component
Schottky Diode
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0231133037
Current
200mA
Diode
1
Current(Ir)
2uA@25V
(Vf)
800mV@100mA
Electronic Component
Electronic Component
Electronic Component
3000
Voltage Rating(Vr)
30V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BAT54S(BLUE ROCKET)产品概述

一、产品简介

BAT54S 是 BLUE ROCKET 提供的一款小尺寸肖特基二极管器件,封装为 SOT-23,内部为一对串联式肖特基二极管(1对串联式)。器件针对低压、高速整流与保护场合优化,具有低正向压降和小结电容的特点,适合便携式和高频电路使用。

二、主要电气参数

  • 正向压降 Vf:0.8 V @ 100 mA(单二极管条件)
  • 最大直流反向耐压 Vr:30 V
  • 额定整流电流 IF:200 mA(连续)
  • 反向漏电流 Ir:2 μA @ 25 V
  • 非重复峰值浪涌电流 Ifsm:600 mA
  • 结电容 CT:约 10 pF(典型)
  • 封装:SOT-23(3 引脚小封装)

三、特点与优势

  • 低正向压降:在中等电流下具有较低的压降,降低功耗与发热(注意 Vf 随电流上升显著增加)。
  • 低漏电流:在常温和中等反向电压下漏电小,利于节能与精密检测电路。
  • 小结电容(10 pF):适合高速开关、信号整形与射频附近应用。
  • 紧凑封装:SOT-23 外形便于空间受限的 PCB 布局与自动化贴片生产。

四、典型应用场景

  • 低压整流与电源二次侧整流(小电流场合)
  • 反向/极性保护、输入浪涌钳位与续流路径
  • 高频信号整流、检波与混频器件
  • 电池管理、小功率开关电源与便携式设备保护电路

五、应用建议与注意事项

  • 功率与热管理:虽额定整流电流为 200 mA,但在无额外散热的 SOT-23 封装中需注意功耗与结温上升,连续工作时建议降额使用或评估 PCB 散热。
  • 峰值冲击电流:Ifsm=600 mA 可应对短时浪涌,但不可长期承受此值。
  • 温度对漏电流影响:高温下 Ir 会显著上升,若在高温或高反向压下使用需验证漏电对系统影响。
  • PCB 布局:尽量缩短高电流路径、增大铜箔面积以提升散热;对高速信号路径注意走线及阻抗控制。
  • 焊接与可靠性:符合 SMD 回流焊规程,避免超出制造商建议的回流温度曲线;佩戴防静电设备操作,器件对 ESD 敏感。

六、型号与选型提示

BLUE ROCKET 的 BAT54S 以其小封装与良好开关性能适合体积受限和高速需求的设计。选型时应重点关注实际工况下的平均电流、峰值电流与工作温度,必要时考虑并联或换用更大功率封装的肖特基器件以满足散热与可靠性要求。

如需封装尺寸引脚图、详细温度特性曲线或交货信息,可进一步提供 PCB 工作电流、工作温度范围及目标应用,我们可给出更精确的选型与布板建议。

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