WMSIC Electronic Components

BLUE ROCKET M7

ModelM7
PackageDO-214AD
BrandBLUE ROCKET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BLUE ROCKET M7
Type
BLUE ROCKET
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BLUE ROCKET
Electronic Component
M7
Electronic Component
1
Package
DO-214AD
Electronic Component
General Purpose Diode
Electronic Component
0.056g
Electronic Component
1
Electronic Component
BM0226538821
Current
1A
Diode
Electronic Component
Current(Ir)
5uA@1kV
(Vf)
1.1V@1A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

M7 产品概述

一、产品简介

M7 为 BLUE ROCKET 品牌的一款高压肖特基整流二极管,采用 DO-214AD(SMAF)封装,专为高压快速整流与反向保护设计。器件在宽温区间(结温 -55℃ 至 +150℃)内稳定工作,结合低正向压降与较小结电容,适合对开关速度和效率有要求的电源与保护电路。

二、主要参数

  • 直流整流电流 If:1A(连续)
  • 非重复峰值浪涌电流 Ifsm:30A(脉冲限制)
  • 直流反向耐压 VRRM:1000V
  • 正向压降 Vf:1.1V @ 1A
  • 反向漏电流 Ir:5μA @ 1kV
  • 结电容 CJ:9pF
  • 工作结温范围:-55℃ ~ +150℃
  • 封装:DO-214AD(SMAF)

三、封装与热管理

DO-214AD(SMAF)为中等体积表面贴装封装,便于自动化贴片与回流焊装配。器件在 1A 工作电流下的功耗约为 P ≈ If × Vf(约 1.1W),实际结温受 PCB 散热面与铜箔面积影响显著。建议在 PCB 设计时提供热铜箔、通孔热 vias 或散热铜面,以保证长期可靠性;并注意回流焊工艺规范以防过热损伤。

四、典型应用场景

  • 高压开关电源(HV SMPS)输出整流或箝位
  • DC-DC 升压电路的高压整流与续流保护
  • 高频整流与开关管保护(受益于肖特基低反向恢复特性)
  • 电源反接保护、过压钳位及高压仪器供电模块

五、设计与使用建议

  • 由于 Vf 在 1A 时为 1.1V,连续高电流条件下会产生显著热量,长期工作请保证充分散热和留有热裕度。
  • 结电容 CJ=9pF 有利于高速开关场合,但在高频敏感电路中仍需关注对谐振与 EMI 的影响,可通过 RC 滤波或合理布局缓解。
  • 反向漏流随温度上升增加,若工作环境温度偏高,应在设计中考虑最大漏电带来的偏差或自热效应。
  • Ifsm=30A 为非重复峰值浪涌能力,适用于吸收短时冲击能量,但不宜作为连续冲击或重复浪涌使用。

六、注意事项与采购信息

  • 器件型号:M7;品牌:BLUE ROCKET;封装:DO-214AD (SMAF)。
  • 选型时确认应用中的最大反向电压、峰值浪涌波形与频率,以确保 Ifsm 与 VRRM 满足实际工况。
  • 建议在样机阶段进行热仿真与实际温升测试,验证 PCB 散热设计与长期可靠性。
  • 采购与替代:如需替代型号,请比对关键参数(VRRM、If、Vf、Ir、Ifsm、封装)以确保功能等效。

该器件结合 1kV 高压耐受、低正向压降与小结电容,适合对体积与性能有平衡需求的高压整流和保护应用。在实际工程中,合理的热管理与电路保护设计可显著提升使用寿命与稳定性。

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