WMSIC Electronic Components

BLUE ROCKET BRCS4435SC

ModelBRCS4435SC
PackageSOP-8
BrandBLUE ROCKET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BLUE ROCKET BRCS4435SC
Type
BLUE ROCKET
Minimum package
4000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BLUE ROCKET
Electronic Component
BRCS4435SC
Electronic Component
1
Package
SOP-8
Electronic Component
1 P
Type
P
Electronic Component
MOSFET
Electronic Component
0.168g
Electronic Component
1
Electronic Component
BM0229921909
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
2.5W
Electronic Component
Electronic Component
Electronic Component
4000
Voltage(Vdss)
30V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BRCS4435SC 产品概述

一、产品简介

BRCS4435SC 是 BLUE ROCKET 推出的单片 P 沟道功率场效应晶体管(P-MOSFET),耐压 30V,适用于中低压高侧开关、负载切换与反向保护等场合。器件采用 SOP-8 封装,设计用于在宽温度范围内可靠工作(-55℃~+150℃)。

二、主要性能参数

  • 类型:P 沟道 MOSFET(单只)
  • 漏源电压 Vdss:30V
  • 连续漏极电流 Id:8.8A
  • 导通电阻 RDS(on):35mΩ @ Vgs = 4.5V
  • 阈值电压 Vgs(th):3.0V @ ID = 250µA
  • 总栅极电荷 Qg:24nC
  • 输入电容 Ciss:1.604nF
  • 输出电容 Coss:408pF
  • 反向传输电容 Crss:202pF
  • 耗散功率 Pd:2.5W
  • 工作温度范围:-55℃~+150℃
  • 封装:SOP-8
  • 品牌:BLUE ROCKET

三、关键特性与优势

  • 低导通阻抗:35mΩ(4.5V 驱动)在中等电流条件下可降低导通损耗,适合 8A 量级负载。
  • 适配逻辑电平驱动:在 4.5V 驱动下给出标称 RDS(on),便于与 5V 或接近电平的控制电路配合。
  • 中等栅极电荷(24nC):开关速度适中,驱动功率与 EMI 可控,适合多数开关场合的驱动器设计。
  • 宽温度工作能力:-55℃ 至 +150℃,适应工业和极端环境。

四、典型应用场景

  • 高侧开关与负载开关(电池供电、车载电子、工业模块)
  • 反向电流保护与理想二极管替代电路
  • 电源管理与功率分配开关
  • 需要 SOP-8 封装且热管理可控的中低压电路

五、设计与使用建议

  • 作为 P 沟道器件,导通需施加负的 Vgs(源电位高于栅极时导通);设计高侧驱动时注意栅极电平管理与保护。
  • 若需快速开关,考虑串联栅极电阻以抑制振铃与控制 dv/dt;Q G = 24nC,驱动器需能提供相应电荷以满足开关时间要求。
  • 在高电流条件下,SOP-8 封装的散热限制需注意:估算功耗(I^2·RDS(on))并在 PCB 上采用铜箔散热、散热过孔或散热面设计以保持结温在安全范围内。
  • 未提供最大 Vgs 或瞬态耐受值时,请在电路中加入限压或瞬态抑制元件,避免栅极损坏;必要时参阅完整数据手册。

六、封装与热管理

SOP-8 封装便于自动贴装与中等功耗应用,Pd = 2.5W(器件功耗散热能力依赖 PCB 散热设计)。建议在 PCB 设计时增加散热铜箔、通过孔或接地/电源层以降低器件结温并延长寿命。

七、选型建议与注意事项

BRCS4435SC 适用于需要 P 沟道高侧切换、工作电压不超过 30V、连续电流在 8–9A 范围内的场合。选择时应核查完整数据手册以确认最大 Vgs、瞬态参数以及封装引脚定义。对于更高效率或更高电流需求,可考虑 RDS(on) 更低或更大封装的替代品;若驱动电压较低(如 3.3V 系统),需确认在该 Vgs 下的 RDS(on) 是否满足系统损耗要求。

如需该器件的完整电气特性曲线、典型应用电路或封装机械图,请提供是否需要获取完整数据手册或工程样品,我可协助进一步评估与设计建议。

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