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BLUE ROCKET 9013M-H
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BLUE ROCKET 9013M-H
- Type
- BLUE ROCKET
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BLUE ROCKET
- Electronic Component
- 9013M-H
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 NPN
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0.03g
- Electronic Component
- 1
- Electronic Component
- BM0232343570
- Transistor Type
- NPN
- Power Dissipation(Pd)
- 450mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Collector Current(Ic)
- 500mA
- Current (h FE)
- 144
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
9013M-H 产品概述
一、产品简介
9013M-H 是 BLUE ROCKET 品牌的一款通用 NPN 小信号/开关三极管，采用 SOT-23 封装，适用于便携式电子设备与一般功率/开关控制场合。单颗供应，封装紧凑，便于表面贴装与自动化生产。
二、主要参数
- 晶体管类型：NPN
- 最大集电极电流 (Ic)：500 mA
- 集-射极击穿电压 (Vceo)：20 V
- 最大耗散功率 (Pd)：450 mW（封装与 PCB 散热条件下）
- 直流电流增益 (hFE)：144 @ Ic=50 mA, Vce=1 V（分档 H：约 144～202）
- 集电极截止电流 (Icbo)：100 nA（典型为漏电小）
- 集-射极饱和电压 VCE(sat)：约 600 mV（测试条件 Ic=500 mA，Ib=50 mA）
- 发射极-基极击穿电压 (Vebo)：5 V
- 封装：SOT-23
三、特点与优势
- SOT-23 小型化封装，适合高密度 PCB 布局。
- 500 mA 的较大集电电流能力，满足中小功率开关和驱动需求。
- 在中等电流（50 mA）条件下 hFE 较高，适合做小信号放大级或前置驱动级。
- 低 Icbo（100 nA）保证了在断态时的低漏电流，有利于低功耗设计。
- 规范的 VCE(sat) 数据可用于饱和开关设计评估。
四、典型应用场景
- MCU/逻辑电平控制的低侧开关与继电器驱动（注意驱动电流需求）
- LED 驱动（需并联限流或采用适配驱动方式）
- 小信号放大、缓冲器、驱动器前级
- 家电与工业控制中对体积与成本敏感的开关场合
五、使用建议与电路注意事项
- 饱和开关时建议按测试条件预留基极驱动能力：若需在 Ic=500 mA 下进入饱和，基极电流约为 50 mA（即强迫增益约 10），普通 MCU 引脚无法直接驱动，应加驱动级或采用外部电阻与驱动器。
- Pd（450 mW）受 PCB 散热影响较大，建议增加铜箔面积或采用散热通孔以降低结温，避免长期在极限功耗下工作。
- 注意 Vebo=5 V，基极反向电压不可过高，防止发射极—基极击穿。
- 推荐在基极串联限流电阻，防止瞬态电流损坏器件；并在接感性负载时并联二极管或使用适当的驱动保护电路。
- 处理与焊接时注意 ESD 防护与温度曲线，以免影响器件性能。
六、封装与选型说明
9013M-H 以 SOT-23 小封装提供，适合自动贴装工艺。选型时请根据工作电流、功耗及散热条件评估是否需要更大封装或并联器件。产品标识与规格以 BLUE ROCKET 官方数据为准，单件采购时请确认库存与批次信息。
如需电气特性曲线、封装尺寸图或典型应用电路板参考，请提供进一步需求，可安排提供详细资料与样品评估。
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