WMSIC Electronic Components

BLUE ROCKET DS34W

ModelDS34W
PackageSOD-123FL
BrandBLUE ROCKET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BLUE ROCKET DS34W
Type
BLUE ROCKET
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BLUE ROCKET
Electronic Component
DS34W
Electronic Component
1
Package
SOD-123FL
Electronic Component
Schottky Diode
Electronic Component
0.024g
Electronic Component
1
Electronic Component
BM0226538810
Current
3A
Diode
Electronic Component
Current(Ir)
500uA@40V
(Vf)
550mV@3A
Electronic Component
55℃~+125℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DS34W 产品概述

一、产品简介

DS34W 是 BLUE ROCKET 出品的一款独立式整流二极管,封装为 SOD-123FL,适用于低电压大电流的整流和保护场合。器件工作结温范围为 -55℃ 至 +125℃,额定整流电流为 3A,能在空间受限的应用中提供可靠的导通和保护功能。

二、主要电气参数(关键值)

  • 正向压降(Vf):550 mV @ 3 A(常态导通损耗参考)
  • 直流反向耐压(Vr):40 V
  • 反向电流(Ir):500 μA @ 40 V(漏电性能)
  • 非重复峰值浪涌电流(Ifsm):80 A(短时浪涌承受能力)
  • 额定整流电流:3 A
  • 工作结温范围:-55℃ ~ +125℃

三、性能要点与解读

  • 低压降设计:在 3A 电流下正向压降仅 0.55V,典型导通功耗约 1.65W(P=I×V),有助于减少功率损耗和发热。
  • 漏电与耐压平衡:40V 的反向耐压适合多数 12V/24V 系统,而 500μA 的反向电流在高温或高压条件下需考虑系统漏电预算。
  • 抗浪涌能力:80A 的短时浪涌能力使其在开机浪涌或瞬态冲击时具备一定生存能力,但长期反复冲击仍需通过保护电路降低应力。
  • 宽温工作:-55℃ 至 +125℃ 的结温范围满足工业级环境需求,但散热设计仍是保证可靠性的关键。

四、典型应用场景

  • 开关电源及整流输出线路的快速整流元件
  • 直流母线保护、反接保护和续流(freewheeling)电路
  • 电池保护与充电管理中的整流/隔离器件(适用于电压低于 40V 的系统)
  • 工业控制、通讯设备及消费类电子的电源管理模块

五、封装与布局建议

SOD-123FL 封装适合自动贴装与回流焊工艺。建议在 PCB 设计中:

  • 为二极管引脚提供较宽铜箔和足够的焊盘面积,以利散热;
  • 在高功率应用处采用散热铜箔和过孔(thermal vias)将热量导向内层或背面地平面;
  • 布局靠近发热源或需要保护的器件,缩短电流回流路径以降低导通损耗。

六、使用与可靠性提示

  • 在高电流长期工作场合,应评估结温并确保在最大结温限制内运行;
  • 反向电流较大时(高温+高压),需注意系统整体漏电流对性能或安全的影响;
  • 对于需要更高耐压或更低漏电的应用,可向供应商咨询系列产品或替代型号;
  • 焊接工艺请参照 BLUE ROCKET 的具体回流焊曲线与规范,避免超出推荐的温度/时间参数以保证焊点可靠性。

七、采购与技术支持

如需样片、批量采购或获取完整的典型特性曲线、封装图与回流焊规范,请联系 BLUE ROCKET 指定代理或销售工程师索取官方数据手册(Datasheet)和应用笔记,以便在设计中正确评估并应用 DS34W。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.