WMSIC Electronic Components

BLUE ROCKET DTA114EKA

ModelDTA114EKA
PackageSOT-23
BrandBLUE ROCKET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BLUE ROCKET DTA114EKA
Type
BLUE ROCKET
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BLUE ROCKET
Electronic Component
DTA114EKA
Electronic Component
1
Package
SOT-23
Electronic Component
1 PNP
Electronic Component
Digital Transistor
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0233262412
Resistor
1
Transistor Type
PNP
Frequency(f T)
250MHz
Power Dissipation(Pd)
200mW
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DTA114EKA 数字晶体管(PNP)产品概述

一、器件简介

DTA114EKA 为 BLUE ROCKET 出品的数字晶体管,封装为 SOT-23,内部集成基极限流电阻,适用于需要简单直接驱动控制的高端侧(PNP)开关场景。该器件以小体积与方便驱动著称,便于电路板空间受限的应用。

二、主要参数(依据提供数据)

  • 晶体管类型:PNP
  • 集-射击穿电压 Vceo:50 V
  • 集电极电流 Ic(最大):100 mA
  • 最大耗散功率 Pd:200 mW
  • 直流电流增益 hFE:30(条件:Ic=5 mA,Vce=5 V)
  • 最小输入电压 VI(on):3 V(条件:Ib 或参考 10 mA),另列 0.3 V(见具体测试条件)
  • 最大输入电压 VI(off):500 mV(条件:Iin=100 μA,Vcc=5 V)
  • 输出导通压 VO(on):300 mV(条件:Ic=10 mA),在小电流(0.5 mA)时亦有标注
  • 电阻比率:1(表示内部限流电阻配置的相对比值)

说明:上述多项指标带有特定测试条件,使用时请结合实际电路工作点核对。

三、典型应用场景

  • 低功耗小电流的高端侧开关与驱动,例如对小信号继电器、指示灯或逻辑电平源的上拉/供电控制。
  • 单片机输出直接控制场景,减少外部限流元件数量,简化 PCB 布局。
  • 电平移位和开漏替代方案,在需要 PNP 源极输出的接口处可提供方便的电平驱动。

四、使用建议与注意事项

  • 注意功耗与散热:Pd=200 mW,持续接近或超过时需考虑散热或限制集电极电流,避免封装过热。
  • 电压与电流极限:Vceo=50 V 与 Ic(max)=100 mA,应在安全裕量内工作,避免瞬态过压或浪涌电流。
  • 驱动电平匹配:依据 VI(on)/VI(off) 的测试条件调整驱动器电平与基极电阻,确保可靠导通与关断。
  • 在高频切换或大电流脉冲场合,需评估瞬态性能与封装热阻对可靠性的影响。

五、封装与 PCB 布局提示

SOT-23 小型封装适合密集布线,但散热能力有限。布线时建议:

  • 将集电极和散热路径靠近外层铜箔,增加焊盘面积;
  • 避免在高功耗运行下将器件夹在热不易散出的区域;
  • 对于开关噪声,适当加旁路电容与吸收元件。

六、选型参考

若系统需要更高的集电流或更大功耗,应选用功率更高的封装或外部驱动器。若追求更小导通压或更高 hFE,可比较同类数字晶体管的增益与 VO(on) 指标。DTA114EKA 在小体积、高电压耐受与集成限流方面具有占优的平衡,适合中低功耗、高端侧开关应用。

如需引脚定义、典型应用电路或更详细的测试曲线,建议查阅器件完整规格书或向供应商索取器件数据手册。

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