WMSIC Electronic Components

BLUE ROCKET S8050M-C

ModelS8050M-C
PackageSOT-23
BrandBLUE ROCKET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BLUE ROCKET S8050M-C
Type
BLUE ROCKET
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BLUE ROCKET
Electronic Component
S8050M-C
Electronic Component
1
Package
SOT-23
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0226538811
Transistor Type
NPN
Frequency(f T)
190MHz
Power Dissipation(Pd)
450mW
Electronic Component
Electronic Component
Electronic Component
3000
Collector Current(Ic)
800mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

S8050M-C 产品概述

一、产品简介

S8050M-C 是 BLUE ROCKET 品牌的一款通用 NPN 双极型晶体管,采用小型 SOT-23 封装,面向低压、高频及中等功率开关/放大场合。器件在中等集电电流工作点具有较高的直流电流增益,适合移动终端、驱动与信号放大等多种应用。

二、主要电气参数

  • 晶体管类型:NPN(双极型)
  • 直流电流增益 (hFE):300(在 IC=100mA、VCE≈1.0V 条件下)
  • 集电极截止电流 (ICBO):100nA(漏电小,适合低静态功耗电路)
  • 集射极击穿电压 (Vceo):25V(适合低压系统)
  • 特征频率 (fT):190MHz(高频特性良好,适用于小信号放大)
  • 允许集电极电流 (Ic):800mA(脉冲或短时能力强,注意功耗限制)
  • 耗散功率 (Pd):450mW(SOT-23 封装,散热能力有限)
  • 射基极击穿电压 (Vebo):6V(基极驱动电压应受限)
  • 集/射饱和电压 (VCE(sat)):约500mV(典型测量条件如 IC=500mA、IB=50mA)

三、关键特性解析

  • 高增益:hFE=300 在 100mA 工况下说明该器件在中等电流下能提供较大电流放大倍数,有利于减少基极驱动电流与前级功耗。
  • 低漏电流:ICBO=100nA 有利于降低关断状态下的泄漏,适合低静态电流要求的电路。
  • 高频性能:fT=190MHz 可用于 VHF 级别的信号放大或高频开关,从而扩展在通信和高速信号链中的应用可能性。
  • 限制与注意:尽管 Ic 标称为 800mA,但由于 Pd 仅 450mW 且封装为 SOT-23,长期大电流工作将受限于 PCB 散热与环境温度,需按实际热阻和电流占空比计算。

四、典型应用场景

  • 低压功率开关:驱动小型电机、继电器或作为低侧开关使用(注意散热设计)。
  • 驱动级/缓冲级:用于继电器驱动、继电器前置驱动以及 LED 短脉冲驱动(Vceo=25V 适用于常见电池与电源)。
  • 小信号放大:音频前置、射频前端或者传感器信号放大,利用其高增益与较高 fT 实现宽带放大。
  • 通用电子产品:家电控制板、玩具、充电器及便携设备中做为通用三极管替代件。

五、使用与散热注意事项

  • PCB 散热:SOT-23 封装热阻较高,建议在集电极对应区域使用大面积铜箔、热铜沉淀或过孔散热以提升耗散能力。
  • 基极限流:开关应用中应配置适当基极电阻以限制基极电流,避免过驱导致基极击穿(Vebo=6V)。
  • 工作条件限制:在长时间或连续大电流工作下,应控制结温和功耗,不可仅以 Ic 最大值作为连续运行依据,应根据 Pd 和热路径评估安全工作点。
  • 测量条件:VCE(sat) 与 hFE 的标称值在特定测试条件下给出,实际电路中会受温度、偏置和频率影响。

六、封装与引脚说明

  • 封装:SOT-23(小型三引脚贴片封装),适合表面贴装自动化生产。
  • 引脚信息:具体引脚排列(B/C/E)和焊盘尺寸请参照 BLUE ROCKET 官方数据手册与封装图纸,生产设计时应以厂家资料为准。

七、选型建议与替代

  • 若电路需更高耐压,请选择 Vceo 更高的型号;如需更大连续功率,考虑更大封装(SOT-223、TO-220 等)。
  • 在要求极低 VCE(sat) 的场合,可考虑低饱和压开关专用晶体管或 MOSFET 替代。
  • 作为通用中功率 NPN,S8050M-C 在多数低压、有限功耗场合性价比高;但高温或高占空比大电流场合需谨慎评估散热。

如需器件引脚图、典型应用电路或热阻、封装尺寸的详细数据表,可提供 BLUE ROCKET 官方 datasheet 以便进一步设计验证。

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