WMSIC Electronic Components

BLUE ROCKET BR2N7002K2

ModelBR2N7002K2
PackageSOT23
BrandBLUE ROCKET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BLUE ROCKET BR2N7002K2
Type
BLUE ROCKET
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BLUE ROCKET
Electronic Component
BR2N7002K2
Electronic Component
1
Package
SOT23
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0233262419
Power Dissipation(Pd)
350mW
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
60V
Capacitor(Ciss)
50pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BR2N7002K2 产品概述

一、主要规格

BR2N7002K2 是一款小功率 N 沟道绝缘栅场效应管(MOSFET),典型参数如下:

  • 漏源耐压 Vdss:60 V
  • 连续漏极电流 Id:300 mA
  • 导通电阻 RDS(on):2.7 Ω @ VGS = 5 V
  • 阈值电压 VGS(th):2.5 V @ ID=250 μA
  • 最大耗散功率 Pd:350 mW
  • 输入电容 Ciss:约 50 pF @ 25 V
  • 反向传输电容 Crss:约 5 pF
  • 最大栅源电压 Vgss:±20 V
  • 封装:SOT-23(品牌:BLUE ROCKET)

二、器件特点

  • 低电压控制即可导通(VGS=5 V 时 RDS(on) 指标给出),适合与常见微控制器或逻辑电平接口配合使用。
  • 较小的输入电容(Ciss ≈ 50 pF)有利于快速开关和较低的驱动功耗,适用于频繁切换场合。
  • 60 V 的耐压等级使其能够在中等电压应用中使用,而额定电流在数百毫安量级,适合驱动小负载或作为信号开关。
  • SOT-23 小封装适合空间受限的设计,但散热能力有限,应注意功率管理。

三、典型应用

  • 低侧开关:驱动小型继电器、LED 矩阵或小电流负载。
  • 电平转换:作为上拉/下拉或开漏驱动器,在 5 V 与更高电压侧间实现隔离或切换(注意 VGS 限制)。
  • 开关矩阵与信号切换:高速开/关、脉冲信号控制场景。
  • 电池供电便携设备中的断电开关或功率路径控制(需注意耗散功率和能耗)。

四、封装与引脚(典型)

封装:SOT-23。常见引脚排列(请以具体器件手册为准):

  • 引脚1:G(栅极)
  • 引脚2:D(漏极)
  • 引脚3:S(源极)
    器件内部包含本体二极管(体二极管),其方向为源→漏(当源端电位高于漏端时二极管导通),在驱动感性负载时需考虑续流路径。

五、使用建议与注意事项

  • 驱动电压:若要求较低的导通压降,应采用 VGS = 5 V 驱动;在 3.3 V 驱动下 RDS(on) 会显著上升,导通能力可能不足。
  • 栅极保护:避免超过 ±20 V 的 VGS 并在有高频切换时加入门极电阻(典型 50–200 Ω)以抑制振荡与减小 EMI。
  • 开关感性负载时并联续流二极管或使用钳位电路,防止电压尖峰损伤器件。
  • 上电顺序与静电防护(ESD):SOT-23 的小芯片对静电敏感,焊接与手工操作时做好防静电措施。

六、热与可靠性

SOT-23 封装的散热能力有限,器件 Pd = 350 mW 为在特定环境温度下的额定耗散功率。在实际电路中:

  • 避免长时间在接近 Pd 的功耗下运行;通过 PCB 加铜面积和热过孔来改善散热。
  • 在高环境温度下按制造商提供的温度系数对耗散能力进行降额设计,保证可靠性。

七、选型要点

  • 若应用需在 3.3 V 逻辑下大电流开关,应选择 RDS(on) 在 2–3 V 驱动电压下也能满足要求的“低 RDS(on)”器件;BR2N7002K2 更适合 5 V 驱动或小电流场景。
  • 关注 VGS(th) 的测量条件(250 μA),实际导通特性与门极电压、漏极电流密切相关,设计时以实际工作点与数据表曲线为准。
  • 对尺寸和成本敏感且需要中等耐压(~60 V)的小功率开关应用,BR2N7002K2 提供了紧凑、经济的解决方案。

如需电路示例、PCB 布局建议或更详细的热计算,可提供具体工作电压与负载条件以便进一步分析。

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