WMSIC Electronic Components

BLUE ROCKET 8050

Model8050
PackageTO-92-2.54mm
BrandBLUE ROCKET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BLUE ROCKET 8050
Type
BLUE ROCKET
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BLUE ROCKET
Electronic Component
8050
Electronic Component
1
Package
TO-92-2.54mm
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.3g
Electronic Component
1
Electronic Component
BM0225825043
Transistor Type
NPN
Frequency(f T)
200MHz
Power Dissipation(Pd)
1W
Electronic Component
Electronic Component
Electronic Component
3000
Collector Current(Ic)
1.5A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

8050 NPN 双极型晶体管(BLUE ROCKET)产品概述

一、器件概述

BLUE ROCKET 8050 是一款通用型 NPN 双极性晶体管,采用 TO-92 小型直插封装(2.54mm 排距)。器件面向一般开关与小信号放大应用,单件包装(数量:1个NPN)。结构紧凑、成本低,适合消费类电子、家电控制、电源前级与信号放大等场合。

二、主要电气参数

  • 集电极电流 Ic:最大 1.5 A(脉冲或受限连续工作条件下)
  • 集-射击穿电压 Vceo:25 V(器件最高电压限制)
  • 功耗 Pd:1 W(无外加散热条件下的最大耗散)
  • 直流电流增益 hFE:典型 300(小电流区)
  • 特征频率 fT:约 200 MHz(高频增益带宽特性)
  • 集电极截止电流 Icbo:约 100 nA(典型,表征漏电)
  • 饱和电压 VCE(sat):约 500 mV(导通时的压降)
  • 发射极—基极击穿电压 Vebo:6 V(需避免反向偏置)

三、典型特性与使用注意

  • 增益与电流相关:标称 hFE=300 为小电流区典型值,随集电极电流增大(接近 Icmax)或进入饱和区时,实际增益会下降。
  • 饱和工作:作为开关使用时,为确保低 VCE(sat),应给予足够基极驱动电流(通常按 Ib = Ic/10 至 Ic/20 估算驱动)。
  • 热管理:Pd = 1W 表明无散热条件下功耗受限,高功率或连续工作时需控制电流、降低占空比或提供良好铺铜/散热片以避免结温过高。
  • 可靠极限:Vceo = 25V 与 Vebo = 6V 是最高允许电压,电路设计时需留有裕度并防止基—发反向击穿。Icbo 较小,长期漏电低,但在高温下会增加。

四、典型应用建议

  • 低压直流开关:驱动小型继电器、指示灯、负载开关(在靠近或低于规格电压和电流条件下)。
  • 前级放大:作共射或共集放大器用于音频、小信号放大(在中低功率、需高 hFE 场合表现良好)。
  • 高频小信号:fT ≈200MHz 使其适合高频放大或缓冲级,但在高频高电流同时要求下需验证稳定性。
  • 驱动级:可用作达林顿或多级放大/驱动电路中的前置或后级器件。

五、封装与引脚

  • 封装:TO-92(直插)— 体积小,便于面包板、插件式电路板使用。
  • 引脚间距:2.54 mm,适配常见插座与通孔 PCB。引脚排列与识别请参考实际出厂管脚图(不同厂商封装标注可能略有差异,采样时务必确认脚位)。

六、选型与可靠性要点

  • 若电路常态工作电流接近或超过数百毫安,务必评估结温与耗散(必要时并联器件或改用更大功率封装)。
  • 对于要求稳定高增益且噪声敏感的前端,应在实际工作点测量 hFE;若需要低 VCE(sat) 的开关,按饱和区基极驱动原则配置驱动级。
  • 避免在超过 Vebo 的条件下反向偏置基—发极,防止不可逆损伤。
  • 在采购与替换时注意封装脚位与参数匹配,BLUE ROCKET 品牌器件如需替换,可对照 Vceo、Ic、Pd 与 hFE 等关键参数选择等效型号。

总结:BLUE ROCKET 8050 是一颗通用、增益高且适用面广的小功率 NPN 晶体管。合理控制功耗与基极驱动、注意热设计与电压裕度,可在多种低压开关与小信号放大场景中稳定工作。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.