WMSIC Electronic Components

BLUE ROCKET 2SB647A-C

Model2SB647A-C
PackageTO-92LM
BrandBLUE ROCKET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BLUE ROCKET 2SB647A-C
Type
BLUE ROCKET
Minimum package
2500 盒

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BLUE ROCKET
Electronic Component
2SB647A-C
Electronic Component
1
Package
TO-92LM
Electronic Component
1 PNP
Electronic Component
Transistor(BJT)
Electronic Component
0.42g
Electronic Component
1
Electronic Component
BM0238699901
Transistor Type
PNP
Frequency(f T)
140MHz
Power Dissipation(Pd)
900mW
Electronic Component
Electronic Component
Electronic Component
2500
Collector Current(Ic)
1A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

2SB647A-C 产品概述

2SB647A-C 为 BLUE ROCKET 推出的通用型 PNP 三极管,TO-92LM 小封装,适用于一般开关与放大场合。器件以高耐压与中等电流能力为特点,适合空间受限、对功耗与散热有一定控制的便携或低功耗设备。

一、规格要点

  • 晶体管类型:PNP(硅)
  • 集电极电流 Ic:1A(最大额定)
  • 集-射极击穿电压 Vceo:100V(典型器件等级)
  • 集极-基极击穿电压 Vcbo:120V(标称)
  • 发射极-基极击穿电压 Vebo:5V(需注意基-发电压限制)
  • 耗散功率 Pd:900mW(TO‑92LM 封装,散热受限)
  • 直流电流增益 hFE:≈100(在 Ic=150mA、VCE=5V 条件下)
  • 特征频率 fT:140MHz(适合小信号放大、较高频率下仍有增益)
  • 集电极截止电流 Icbo:10µA(高压下关断漏电流较小)
  • 集-射极饱和电压 VCE(sat):约1V(在较大电流时测得,如 Ic≈500mA)

二、性能特点

  • 高耐压:100V 的 Vceo 与 120V 的 Vcbo,使其可用于高电压回路的 PNP 侧开关或放大器。
  • 中等电流能力:1A 的峰值集电极电流满足大多数小功率驱动与开关需求,但受限于封装耗散。
  • 高频特性良好:fT=140MHz,适合用于中高频小信号放大及驱动场合。
  • 增益稳定:在中等电流工作点(≈150mA)有较高直流增益,便于偏置设计。

三、典型应用场景

  • 高侧开关:作为 PNP 高侧开关元件,在正电源侧控制负载断通。
  • 互补推挽放大:与 NPN 互补搭配用于小功率音频输出级或信号放大器。
  • 中高压小信号放大器:利用较高的 fT 在 VHF 以下频段进行增益放大。
  • 通用开关与驱动:驱动继电器小负载、作为电平翻转或电源管理电路中的元件。

四、使用建议与注意事项

  • 散热与功耗:TO‑92LM 封装 Pd=900mW,长期工作时须注意功率分布与结温上升。在大电流或高 VCE 梯度下应避免长时间高耗散工作,可通过降低电压、缩短导通时间或选用更大封装器件来解决。
  • 基极-发射极耐压低:Vebo=5V,基-发电压限制较低,偏置设计时避免超过该值以免损坏结。
  • 饱和驱动:在做开关导通设计时,需提供足够基极驱动电流以降低 VCE(sat);同时注意基极电流不宜过大,否则会超过基极或外围电路限制。
  • 工作环境:高温会降低 Pd 与 hFE,设计时应留有裕量并考虑温度漂移与增益变化。
  • 引脚与封装:TO‑92LM 引脚排列可能因厂家略有差异,设计印制板前请参考正式数据手册核实引脚定义。

五、选型与替代建议

  • 若电流或功耗要求更高,应考虑更大功率封装(如 TO‑126/TO‑220)或并联多个器件,注意并联要考虑电流均衡。
  • 若需更高 Vebo(基-发更高耐压),请选择基-发击穿更高的型号以提高可靠性。
  • 在高频功率放大场合,需综合考虑封装引线电感与热耗,评估实际增益与稳定性。

总结:2SB647A-C 为一款耐压高、增益适中且频率特性良好的通用 PNP 小信号三极管,适合高侧开关、互补放大与中高压小信号放大等场合。设计时重点关注封装散热限制与基-发电压(Vebo)限制,按实际工况做好偏置与热设计即可发挥其性能。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.