Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Broadcom(博通) HSMF-C114
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- Broadcom HSMF-C114
- Type
- BROADCOM
- Unit
- Electronic Component
- Minimum package
- 4000 圆盘
Technical parameters
- Power
- G:78mW；B:78mW；R:48mW
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- BROADCOM
- Electronic Component
- HSMF-C114
- Electronic Component
- 1
- Electronic Component
- 1.5mm
- Package
- 0606
- Electronic Component
- G:515.0nm~535.0nm；B:460.0nm~480.0nm；R:620.0nm~635.0nm
- Electronic Component
- RGB LED
- Electronic Component
- 0.022g
- Electronic Component
- 1.6mm
- Electronic Component
- 0.35mm
- Electronic Component
- 1
- LED
- B:70.0mcd；G:180.0mcd；R:85.0mcd
- LED
- 140°；145°
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
HSMF-C114 产品概述
一、产品简介
HSMF-C114 为 Broadcom（博通）出品的 RGB 扩散型 CHIP SMD 发光二极管，封装尺寸为 0606（1616 公制），采用白色散光透镜与共阳极（Common Anode）配置。器件体积微小（1.6 × 1.5 × 0.35 mm），适合对尺寸和视角有较高要求的背光、指示灯及消费类电子产品。
二、主要特性
- 三色共阳极设计，简化驱动与 PCB 布局。
- 波长与峰值：绿 (G) 波长 515–535 nm，峰值 523 nm；蓝 (B) 波长 460–480 nm，峰值 468 nm；红 (R) 波长 620–635 nm，峰值 637 nm。
- 发光强度（典型）：B 70.0 mcd、G 180.0 mcd、R 85.0 mcd。
- 宽视角设计：约 140°~145°（颜色相关略有差异）。
- 额定正向电流每色 20 mA，正向压降：G/B 3.4–3.9 V，R 1.9–2.4 V。
三、光电性能概览
- 功率（典型）：G/B 78 mW，R 48 mW。
- 工作温度范围：-40 ℃ ~ +85 ℃，适合室内外环境的常见温度变化。
- 透镜白色扩散处理，可获得均匀柔和的出光效果，降低点光源感。
四、封装与机械尺寸
- 尺寸（长 × 宽 × 高）：1.6 mm × 1.5 mm × 0.35 mm。
- 封装：0606（1616 公制）贴片，便于高速贴装与回流焊工艺集成。
- 建议在 PCB 设计中预留适度的散热与焊盘尺寸以保证焊接可靠性。
五、典型应用
- 消费电子指示灯、按键背光与装饰性照明。
- 可穿戴设备、微型显示与仪表盘点光源。
- 小型标识、信号指示及色彩混合场景（通过 PWM 实现色彩控制）。
六、使用建议与注意事项
- 驱动方式：共阳极结构需对每色阴极独立限流或 PWM 驱动，计算限流电阻时请参考各色 Vf 与目标 If（最大 20 mA）。
- 散热与寿命：推荐在额定电流下运行并按需做电流降额以延长使用寿命。
- 工艺与可靠性：遵循厂商回流焊工艺及 ESD 防护要求，贴装与回流参数以实际数据表为准。
- 储存与搬运：避免强烈挤压与长期潮湿环境，必要时参照湿敏等级与回流前烘烤规范。
以上为 HSMF-C114 的产品概述，若需进一步的电气特性曲线、焊接曲线或样品采购信息，可提供具体需求以便查询详细数据手册。
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