WMSIC Electronic Components

Broadcom HCPL-0611-500E

ModelHCPL-0611-500E
PackageSOP-8
BrandBroadcom
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Broadcom HCPL-0611-500E
Type
BROADCOM
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BROADCOM
Electronic Component
HCPL-0611-500E
Electronic Component
1
Package
SOP-8
Electronic Component
Logic Output Optocoupler
Electronic Component
0.169g
Electronic Component
1
Channel Count
1
CMTI(kV/us)
25kV/us
Electronic Component
10Mbps
Features
Output; Collector Output
Electronic Component
BM0230874022
Operating Temperature
40℃~+85℃
Operating Voltage
4.5V~5.5V
Type
DC

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HCPL-0611-500E 产品概述

一、产品简介

HCPL-0611-500E 是 Broadcom(博通)系列的单通道光隔离器,面向高速逻辑信号隔离场合。器件为直流输入、逻辑输出(开集电极)结构,传输速率可达 10Mbps(10MBd),适合需要高速、坚固隔离的数字接口应用。封装为 SOP-8(高脚型),便于安装与散热。

二、主要特性

  • 工作电压(VCC):4.5V ~ 5.5V,直接兼容常见 5V 逻辑电源。
  • 隔离耐压(Vrms):5kV(器件级隔离,满足高电压差场合的安全需求)。
  • 共模瞬态抗扰度(CMTI):25kV/μs,能承受快速变化的共模电平,减少误触发。
  • 传输速率:10Mbps,低延迟数字信号传输。
  • 输出类型:开集电极(需外接上拉电阻),带肖特基箝位以减少反向恢复和晃动。
  • 工作温度:-40℃ ~ +85℃,适合工业级环境。

三、电气与时序参数摘要

  • 传播延迟:tpLH ≈ 25ns,tpHL ≈ 20ns,适合实时性要求较高的控制链路。
  • 输入阈值电流(F_H):5mA(典型触发/驱动输入参考)。
  • 输出驱动能力:最大 50mA,能驱动下游逻辑或小功率负载(实际使用请参照数据表)。
  • 正向压降 Vf:1.5V(LED 正向参考),正向电流 If:20mA;直流反向耐压 Vr:5V。
  • 功耗 Pd:85mW(器件耗散功率,需考虑散热与系统功耗预算)。

四、封装与机械特性

  • 封装:SOP-8(高脚型),利于通孔/贴片 PCB 布局以及与标准插座/插针兼容。
  • 单通道设计,便于在多通道系统中按需并列使用。

五、典型应用

  • 工业自动化中 MCU/FPGA 与高压侧电路的信号隔离。
  • 开关电源或电机驱动反馈与控制信号隔离。
  • 串行或并行高速数字接口隔离(需 10Mbps 速率支持)。
  • 医疗设备、仪器仪表中对地电位差大的安全隔离(配合系统认证使用)。

六、设计建议与注意事项

  • 由于输出为开集电极,必须外接合适的上拉电阻;上拉电压应在器件 VCC 范围内(通常为 5V)。选择上拉电阻时需兼顾上拉速率与功耗/输出电流能力。
  • 肖特基箝位能减少输出回弹与开关过冲,但真实效果依赖 PCB 布局与负载特性。高速信号路径应缩短,走线靠近接地面以降低共模干扰影响。
  • 注意器件隔离额定与系统安全要求之间的差异,若系统要求更高绝缘等级,请参考完整数据手册与认证规范。
  • 在高 CMTI 环境(快速开关电源或功率器件旁)布置时,应优化接地与屏蔽,避免通过共模耦合引起误动作。

如需原厂数据手册、引脚排列或典型电路图,可进一步提供以便给出更详细的选型与布局建议。

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