WMSIC Electronic Components

Broadcom HCPL-4504-500E

ModelHCPL-4504-500E
PackageSMD-8-300mil
BrandBroadcom
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Broadcom HCPL-4504-500E
Type
BROADCOM
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BROADCOM
Electronic Component
HCPL-4504-500E
Electronic Component
1
Package
SMD-8-300mil
Electronic Component
Logic Output Optocoupler
Electronic Component
0.851g
Electronic Component
1
Channel Count
1
CMTI(kV/us)
15kV/us
Features
Collector Output
Electronic Component
BM0230874012
Operating Temperature
55℃~+100℃
Operating Voltage
500mV~30V
Type
DC
Output Current
8mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HCPL-4504-500E 产品概述

一、产品简介

HCPL-4504-500E(Broadcom)是一款单通道晶体管输出型光隔离器,适用于数字信号隔离与电平移位。器件采用 DIP-8-300mil 封装(鸥翼引脚)封装形式,兼顾可靠的电气隔离与便捷的电路板插装。器件设计用于在恶劣环境下提供稳健的信号隔离和抗干扰能力。

二、主要规格

  • 输入类型:DC
  • 工作电压范围(VCC):0.5V ~ 30V
  • 隔离电压:2.5 kVrms(资料中亦见 3750 Vrms 的标注,请以供应商规格书为准)
  • 共模瞬态抗扰度(CMTI):15 kV/µs
  • 电流传输比(CTR):25%(典型)
  • 通道数:1
  • 工作温度:-55 ℃ ~ +100 ℃
  • 传播延迟:tpLH ≈ 500 ns,tpHL ≈ 300 ns
  • 输出电流(最大):8 mA
  • 耗散功率 Pd:100 mW
  • 输入正向压降 Vf:1.5 V(If = 指定值)
  • 输入直流反向耐压 Vr:5 V
  • 输入正向电流 If(最大):25 mA

三、特点与优势

  • 高可靠隔离:器件提供千伏级隔离(资料差异请核实),适合电气隔离和保护应用。
  • 良好抗干扰能力:15 kV/µs 的 CMTI 使其在高共模干扰环境中仍能保持信号完整性。
  • 低功耗与小体积:DIP-8 封装便于插装与手工焊接,Pd 为 100 mW,适合功耗受限设计。
  • 中低速数字信号适配:数百纳秒量级的传播延迟适合 MCU、控制总线等中低速接口隔离。

四、典型应用

  • 工业控制信号隔离(传感器、继电器驱动逻辑)
  • MCU 与高电位电路之间的电气隔离
  • 电源管理与数据采集系统的接口保护
  • 医疗和通信设备的安全隔离(需按最终认证规格确认耐压值)

五、使用建议与注意事项

  • 输入侧驱动:输入正向电流 If 不得超过 25 mA;为保证寿命与 CTR,建议常用驱动电流小于最大值的比例。
  • 输出负载与上拉电阻:输出电流最大 8 mA,计算上拉电阻 Rpull = (VCC − VOL)/Iout,务必使 Iout ≤ 8 mA。举例:若 VCC = 5 V,欲限制输出电流到 4 mA,则 R ≈ 1.25 kΩ。
  • PCB 布局:保持输入与输出的爬电距离和间隙,遵循器件隔离规格;在输出侧加 decoupling 电容以稳定电源。
  • 热管理与功耗:单通道 Pd 为 100 mW,注意在高温环境下的功耗限制与结温上升。
  • 规格核实:资料中隔离电压出现差异(2.5 kVrms 与 3750 Vrms),在关键安全或认证场合请以 Broadcom 的正式 datasheet 与样片测试为准。

如需我为具体电路给出上拉电阻计算范例、PCB 布局检查要点或与替代器件对比,请告知系统电压与目标信号速率,我可给出更详细的工程建议。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.