Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CJ MMBT3906
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- CJ MMBT3906
- Type
- CJ
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CJ
- Electronic Component
- MMBT3906
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 PNP
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0.032g
- Electronic Component
- 1
- Electronic Component
- BM0095945918
- Operating Temperature
- 55℃~+150℃
- Transistor Type
- PNP
- Frequency(f T)
- 300MHz
- Power Dissipation(Pd)
- 200mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MMBT3906 产品概述
一、产品简介
MMBT3906 是一款 NPN 型晶体管，常用作小信号放大和开关应用。它的封装形式为 SOT-23，具有较小的体积，适合在空间有限的电子设备中使用。该型号的最大集电极电压为 40V，最大集电极电流为 200mA（0.2A），这使得它能够在多种应用场合中稳定工作。
二、关键规格
- 类型：PNP
- 封装：SOT-23
- 最大集电极电压（V_CE）：40V
- 最大集电极电流（I_C）：200mA
- 功耗（P_D）：0.2W
- 增益（h_FE）：在较大范围内，其直流电流增益通常为 100 到 300，具体取决于工作条件。
三、应用场景
开关电路：由于其良好的开关特性，MMBT3906 特别适合用于小功率开关电路。无论是用于驱动继电器、LED 还是其他负载，这款晶体管都能稳定工作。
放大电路：在音频放大器和其他类型的信号放大应用中，MMBT3906 可以提供良好的增益。这种特性使得它能够在高保真音频系统中，或在其他信号处理电路中得到广泛应用。
电源管理：在电源分配和管理电路中，MMBT3906 常用于控制信号，从而调节电源的输出。这在便携式设备和智能手机中非常常见。
开关电源：MMBT3906 可以用在开关电源的驱动环节，帮助改善能效并减小体积。
四、封装特性
SOT-23 封装是一种非常通用的表面贴装包封，适合于自动化生产线的安装。其小巧的设计使得设备在尺寸和重量上的优化成为可能。同时，SOT-23 封装的焊接特性也保证了在长期使用中的可靠性。
五、优缺点
优点：
- 小尺寸：适合空间有限的应用。
- 高效能：能够处理较高的电压和电流。
- 良好的增益特性：在小信号放大中，具有较高的增益。
缺点：
- 功耗限制：虽然达到 0.2W，但在高功耗应用中，可能需要其他解决方案。
- 仅适用小信号：对于大功率应用，可能需要选择其他类型的晶体管。
六、使用注意事项
- 热管理：在应用中需要注意晶体管的功耗管理，以防因过热而损坏。适当的散热策略是确保其长期稳定运行的关键。
- 偏置电路设计：在使用 MMBT3906 进行放大时，需正确设计偏置电路，以确保晶体管在工作的线性区。
七、总结
MMBT3906 是一款非常实用的 PNP 型晶体管，适用于各种小信号放大和开关电路。凭借其优越的电气性能和紧凑的封装，广泛应用于现代电子设备中。在设计电路时，了解其规格参数及工作特性是至关重要的，以确保电路的最佳性能和稳定性。选择 MMBT3906，能够帮助工程师在设计中实现更高效、可靠的解决方案。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
