Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CJ DSS34
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- CJ DSS34
- Type
- CJ
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CJ
- Electronic Component
- DSS34
- Electronic Component
- 1
- Package
- SOD-123FL
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.043g
- Electronic Component
- 1
- Electronic Component
- BM0220903211
- Current
- 3A
- Diode
- Electronic Component
- Current(Ir)
- 500uA@40V
- (Vf)
- 550mV@3A
- Electronic Component
- 55℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
DSS34 产品概述
一、产品简介
DSS34是江苏长电（CJ）公司推出的一款高性能肖特基二极管，采用独立式封装，型号为SOD-123FL，具有出色的电气特性和广泛的应用潜力。此二极管的显著特点是其低正向压降（550mV@3A）和较高的额定反向电压（40V），使其在高速开关和高频操作中尤其具有优势。DSS34广泛应用于各种电子电路，如电源管理、整流电路以及保护电路等。
二、主要特点
低正向压降：
- 在3A的工作条件下，DSS34的正向压降仅为550mV。这意味着在高电流应用中，此二极管能够显著降低能量损耗，提高系统的整体效率。
额定反向电压：
- 该器件的反向电压为40V，适合用于中等电压的应用场合，可以有效应对大多数常见的电源电路需求。
高温性能：
- DSS34在高温环境下使用表现良好，能够稳定地提供可靠的性能，适合在工业环境及严酷条件下运行。
封装形式：
- 采用SOD-123FL封装，具有良好的散热性能和小型化优势，适合高密度的电路设计。此封装形式还便于自动化贴片生产，提升组装效率。
优异的瞬态响应：
- 该肖特基二极管具有较快的开关速度，在高频信号的切换中表现尤为突出，适合用于开关电源和高频变换器等应用。
三、应用领域
DSS34的应用范围非常广泛，包括但不限于：
电源管理：
- 在开关电源（SMPS）中，DSS34可用于整流和续流元件，通过低压降特性降低功耗，提高效率。
整流电路：
- 在各类整流电路中，DSS34有效地转换AC为DC，广泛应用于适配器、充电器和电池管理系统。
保护电路：
- 在过压或反向电流的保护电路中，DSS34能够提供快速反应的保护，防止其他元件受损。
汽车电子：
- 随着汽车电子设备的普及，DSS34也可以用于汽车电源管理系统内，保护及整流功能确保车载电气系统的稳定性。
通信设备：
- 在各种通信设备中，该二极管用于信号整流和保护，帮助提高通信质量和设备可靠性。
四、总结
DSS34作为一款性能优异的肖特基二极管，以其低正向压降、合适的反向电压和高温稳定性，在现代电子设备中展现出巨大的应用潜力。无论是在电源管理、整流受保护电路，还是汽车电子与通信设备中，DSS34都为工程师们提供了一个可靠且高效的解决方案。随着电子技术的不断发展和进步，DSS34必将在更多创新应用中发挥关键作用。欢迎各位工程师和企业在设计中考虑DSS34，进一步提升产品的性能与竞争力。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
