WMSIC Electronic Components

CJ CESD3V3D3

ModelCESD3V3D3
PackageSOD-323
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ CESD3V3D3
Type
CJ
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJ
Electronic Component
CESD3V3D3
Electronic Component
1
Package
SOD-323
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.03g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
120pF
Electronic Component
BM0092081023
Voltage
13V
Electronic Component
IEC 61000-4-2
Current(Ir)
10uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:CESD3V3D3

一、基本信息

CESD3V3D3是江苏长电(CJ)推出的一款表面贴装器件,封装形式为SOD-323。该产品被广泛应用于电子电路中的静电放电(ESD)保护,专为低压和小型化电子产品设计。由于其小巧的封装和高效的保护能力,CESD3V3D3适合用于各种便携式设备、消费电子和工业应用。

二、主要特点

  1. 小型化封装:SOD-323封装体积小,非常适合现代电子设备对空间的要求。
  2. 静电放电保护:CESD3V3D3能够有效应对IEC 61000-4-2标准下的静电放电(ESD)攻击,为电子设备提供保护,确保其可靠性和稳定性。
  3. 多用途应用:适用于USB接口、HDMI、音频接口等多种信号线保护,能够保障敏感元器件在遭受环境干扰时的正常运行。
  4. 高击穿电压:该器件具备较高的击穿电压和响应速度,能够在短时间内快速抑制过电压,有效降低设备损坏的风险。

三、功能与应用

CESD3V3D3的主要功能是对电气设备中的高电压瞬变提供可靠的保护,对防止静电放电造成的损害尤为重要。随着电子产品技术的进步,静电放电问题愈发突出,尤其是在手持设备、穿戴设备及其他轻量化的电子产品中,CESD3V3D3通过优越的性能满足了这些市场的需求。

  • 消费电子:如智能手机、平板电脑、笔记本电脑等便携式设备,对ESD具有极高的敏感性,采用CESD3V3D3能够有效延长设备寿命和增强用户体验。
  • 工业设备:在工控行业,ESD防护也是不可忽视的安全因素,CESD3V3D3可用于保护各种传感器、通讯接口和控制电路。
  • 汽车电子:随着汽车智能化的推进,越来越多的电气系统需要ESD保护,CESD3V3D3可以有效提升汽车电子系统的抗干扰能力。

四、技术规格

CESD3V3D3的技术参数包括:

  • 额定电压:3.3V
  • 最大导通电压:通常在5V以下
  • 击穿电压:提供的击穿电压足以应对大多数静电放电干扰
  • 封装尺寸:SOD-323,利于自动化贴片装配,有助于降低生产成本
  • 工作温度范围:广泛的工作温度范围,适合多种环境下使用

五、总结

CESD3V3D3是一款优秀的ESD保护器件,凭借其小型化封装和强大的性能受到广泛青睐。无论是消费电子、工业自动化,还是汽车电子,其高效的抗静电能力都能为最终用户提供极大的安全保障。随着市场对电子产品要求的不断提高,CESD3V3D3必将成为众多设计方案中的理想选择。选择江苏长电的CESD3V3D3,找回您对电子设备稳定性的信心,实现安全、可靠的电子应用。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.