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CJ MB10S
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- CJ MB10S
- Type
- CJ
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CJ
- Electronic Component
- MB10S
- Electronic Component
- 1
- Package
- MBS
- Type
- Electronic Component
- Electronic Component
- Bridge Rectifier
- Electronic Component
- 0.213g
- Electronic Component
- 1
- Electronic Component
- BM0235662480
- Current
- 1A
- Current(Ir)
- 10uA@1kV
- (Vf)
- 1V@1A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MB10S 单相桥整流器（CJ，MBS 封装）概述
一、产品概述
MB10S 是一款由 CJ（江苏长电/长晶）提供的单相桥式整流器，采用 MBS 塑封外壳，面向低功率到中等功率的交流—直流整流应用。器件在 1A 持续整流电流条件下具有低正向压降和高直流耐压的特点，兼顾了效率与耐压性，适合小型电源、开关电源前端整流及工业控制等场景。
二、主要参数
- 正向压降 (Vf)：1.0 V @ IF = 1 A（典型/额定条件）
- 直流反向耐压 (Vr)：1000 V（1 kV）
- 整流电流 (IO)：1 A（平均整流电流）
- 反向电流 (Ir)：10 μA @ Vr = 1 kV（漏电流小）
- 非重复峰值浪涌电流 (Ifsm)：35 A（单向脉冲浪涌能力）
- 工作结温范围：-55 ℃ ～ +150 ℃
- 类型：单相桥整流，四二极管桥结构
- 封装：MBS（塑封）
三、主要特性与优势
- 高耐压：1 kV 的反向耐压适合高压工况或隔离较大的输入侧电路。
- 低正向压降：1 V 在 1 A 条件下可降低导通损耗，提高整流效率。
- 低漏电流：10 μA 在 1 kV 下的低反向电流利于高阻抗或高压测量电路。
- 良好浪涌能力：35 A 的峰值浪涌电流可承受启动或充电时的短时冲击（典型为 8.3 ms 半波）。
- 宽温度范围：-55 ～ +150 ℃ 的工作结温支持苛刻环境下的可靠工作。
四、典型应用
- 小功率开关电源与线性电源的整流环节
- 适配器、充电器与电源模块的前端整流
- 工业控制设备、仪表与传感器电源
- 极性保护、反接保护和桥式整流器替代方案
- 高压直流电源与隔离电路中的整流使用
五、热管理与使用建议
- 导通损耗估算：桥式整流时每半周由两只二极管导通，近似导通损耗为 Pd ≈ 2 × Vf × IF(av)。在 IF(av)=1 A 时，Pd ≈ 2 W，应据此设计散热以保持结温在允许范围内。
- 若长期接近额定电流或工作在高环境温度下，建议采用适当的散热片或保证良好 PCB 散热（增加铜箔面积、过孔热通道）。
- 浪涌电流能力为短时值，不建议将 Ifsm 用作连续工作电流；避免频繁的大浪涌以延长器件寿命。
- 在高压应用中注意爬电与间隙距离，合理布局与绝缘措施，防止表面击穿或爬电引起失效。
六、封装与可靠性提示
MBS 塑封体便于波峰/回流焊装配，适合自动化生产。储存与回流焊温度应遵循厂商推荐（出于可靠性建议避免超出封装极限温度并减少潮气影响）。使用前如需长期高可靠性，请参考 CJ 的完整数据手册进行封装、焊接与热循环测试规范。
总结：MB10S 在小型整流场合提供了高耐压、低漏、低压降和适度浪涌能力的平衡，是常见的 1 A 级单相桥整流选择；在使用中注意热设计与高压绝缘，能获得稳定长期运行。
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