WMSIC Electronic Components

CJ SMF15CA

ModelSMF15CA
PackageSOD-123FL
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ SMF15CA
Type
CJ
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJ
Electronic Component
SMF15CA
Electronic Component
1
Package
SOD-123FL
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.042g
Electronic Component
1
Electronic Component
BM0226365533
Operating Temperature
55℃~+150℃
Voltage
24.4V
Current(Ir)
1uA
Voltage(VBR)
18.5V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMF15CA 瞬态抑制二极管(TVS)产品概述

一、产品简介

SMF15CA 是江苏长电(CJ/长晶)生产的一款双向瞬态电压抑制二极管(TVS),采用 SOD-123FL 表贴封装,专为抑制瞬态过电压和浪涌脉冲而设计。器件面向工业、通信、消费电子和汽车等需要可靠瞬态保护的场合,能在极短时间内吸收高能脉冲,保护下游电路免受浪涌损害。

二、主要参数特性

  • 钳位电压(Vc):24.4 V(典型值,通常在指定脉冲测试条件下测得)
  • 反向工作电压(Vrwm):15 V(稳态工作电压,推荐不超过该值以避免进入击穿区)
  • 击穿电压(Vbr):18.5 V(器件进入雪崩导通的电压区间)
  • 峰值脉冲功率(Ppp):200 W @ 10/1000 μs(10/1000 μs 波形下瞬态吸收能力)
  • 峰值脉冲电流(Ipp):8.2 A @ 10/1000 μs(对应 Ppp 条件下的峰值电流)
  • 反向电流(Ir):1 μA(在 Vrwm 条件下的泄漏电流,典型低泄漏)
  • 极性:双向(适用于交流或可能发生极性反转的线路)
  • 工作温度范围:-55 ℃ ~ +150 ℃(宽温区,适合苛刻环境)
  • 封装:SOD-123FL(小型低剖面表贴封装,便于自动贴装与密集布板)

说明:上述钳位电压与脉冲参数通常基于标准 10/1000 μs 浪涌波形测试,实际电路中钳位值会受 PCB 热阻、环境温度及连续冲击次数影响。

三、典型应用场景

  • 汽车电子微电源与传感器接口(考虑到宽温特性和瞬态抑制能力)
  • 工业控制与PLC 输入/输出保护
  • 通信设备电源与接口保护(如 PoE 辅助线路、通信端口)
  • 电源模块、DC-DC 转换器前端浪涌抑制
  • 消费类电子设备在电源线、信号线的瞬态保护

由于为双向结构,尤其适用于可能出现反向电压或交流工况的保护场合;对直流永久极性且需更低钳位的场景,也可考虑相应的单向型 TVS 器件。

四、选型与使用建议

  • 工作电压选择:确保 Vrwm(15 V)高于系统正常工作电压峰值,以避免持续漏电或误触发。对于 12 V 系统(典型车载 12 V 档),SMF15CA 可作为合适的保护件;在 24 V 系统中需评估钳位电压(24.4 V)是否在被保护器件可耐受范围内。
  • 能量与脉冲要求:Ppp=200 W(10/1000 μs)和 Ipp=8.2 A 表明可吸收中等能量冲击。若预期更高能量雷击或多次冲击,需选择更高功率或并联/级联保护策略。
  • 极性选择:对永久直流供电且要求最低钳位电压时,使用单向 TVS 更优;对交流或极性可能反转的线路,使用本款双向型号。
  • 温升与散热:长时间或高频次脉冲会导致封装升温,PCB 布局应提供热沉路径(加大铜箔面积、使用热盲孔或接地铜平面)以降低器件应力。

五、封装与焊接注意

  • 封装为 SOD-123FL,适用于自动贴片与回流焊流程。建议遵循 SMD 回流焊标准(如 J-STD-020)进行焊接,注意控制峰值温度与保温时间,避免超温损伤。
  • 在 PCB 布局上,确保器件靠近被保护的输入端或连接边缘,减少走线电感,提高响应速度与抑制效率。
  • 为减少温度和应力集中,焊盘设计应与制造商推荐的 PCB 尺寸一致,并在需要时增加热铜区。

六、可靠性与环境适应

  • 宽工作温度(-55 ℃ 至 +150 ℃)适合高温环境与车辆发动机舱等苛刻场景,但在高温下泄漏电流和击穿特性会有一定漂移,设计时需考虑温漂。
  • 建议在关键应用中做工程样机测试(含多次冲击、长时耐受测试)以验证实际系统可靠性。
  • 存储与使用时避免静电直接击穿,良好的接地和装配流程有助于延长器件寿命。

七、常见问题与故障排查

  • 若出现频繁触发或过热,应检查:是否选型与系统电压匹配、是否存在连续高能脉冲、PCB 散热是否不足。
  • 若发现泄漏电流高于规格,建议在室温与高低温条件下复测 Vrwm 下的 Ir,以排除焊接损伤或静电损坏。
  • 对于出现多次冲击后性能下降的器件,需评估是否超出单次或累积吸收能量规格,必要时考虑更大功率或外部限流元件配合使用。

总结:SMF15CA 提供了在小封装条件下良好的双向瞬态保护能力,适合对体积、温度和中等能量浪涌有要求的应用场景。选型时需综合考量系统工作电压、可接受的钳位电压及预期冲击能量,配合合理的 PCB 布局与热管理可获得稳定可靠的保护效果。

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