Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CJ DSS24
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- CJ DSS24
- Type
- CJ
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CJ
- Electronic Component
- DSS24
- Electronic Component
- 1
- Package
- SOD-123FL
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.043g
- Electronic Component
- 1
- Electronic Component
- BM0220935379
- Current
- 2A
- Diode
- Electronic Component
- Current(Ir)
- 500uA@40V
- (Vf)
- 550mV@2A
- Electronic Component
- 55℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
DSS24 产品概述
一、产品简介
DSS24 是一款高性能肖特基二极管，采用 SOD-123FL 封装，主要用于电源管理、逆向保护、整流、开关电源等应用场景。凭借其优良的电气特性，该产品在消费类电子、工业控制、通信设备及汽车电子等领域中具有广泛的应用潜力。
二、主要特点
低正向压降： DSS24 在 2A 工作电流下的正向压降仅为 550mV，这一特性显著降低了电源损耗，提高了整体电路的效率。正向压降的降低不仅使得功率损耗降低，还能够帮助设计工程师节省热管理方案的成本。
高反向耐压： 该肖特基二极管的最大反向耐压为 40V，适用于大多数低压电源应用场合。其反向耐压能力使得在日常工作环境中，DSS24 能有效承受电路中可能出现的反向电压，提高了电力系统的可靠性。
高工作温度范围： DSS24 的工作温度范围广泛，能够适应多种环境条件。在高温或低温的工作条件下，DSS24 依然保持出色的性能，为不同应用场景提供了灵活支持。
小巧的封装设计： SOD-123FL 封装设计具有较小的尺寸，有助于降低板级空间占用，适合小型电子设备的紧凑设计需求。该封装便于自动化贴片，节省生产时间，提高生产效率，同时也有助于提升整体产品的可靠性和稳定性。
三、应用领域
由于其优异的性能，DSS24 广泛应用于以下领域：
电源管理： 在 DC-DC 转换器、AC-DC 转换器等电源管理系统中，DSS24 可用于整流电路，有效提高系统效率。
逆向保护： 采用 DSS24 均能有效保护电路设备免受反向电压冲击，降低设备损坏的风险，延长设备使用寿命。
高频开关电源： 由于其极低的正向压降和快速的恢复特性，DSS24 适合用于高频开关电源的整流，能为高频电源系统提供安全且高效的整流解决方案。
消费类电子： 在各类消费类电子产品中，DSS24 可用于电池管理、电源适配器、充电器等应用，兼顾小型化和高效能的要求。
汽车电子： 在汽车电子行业中，DSS24 同样具备一定的市场需求，能够有效应对汽车电源系统中的各种工况。
四、性能参数
| 参数 | 值 |
|---|---|
| 产品类型 | 肖特基二极管 |
| 封装类型 | SOD-123FL |
| 正向电流 (IF) | 2A |
| 正向压降 (VF) | 550mV@2A |
| 反向耐压 (VR) | 40V |
| 工作温度范围 | -55℃到+125℃ |
五、总结
DSS24 是一款性能卓越、适用性广泛的肖特基二极管，凭借其低正向压降、高反向耐压及小巧的封装，能够满足不同电源管理、电路保护和电子设备的需求。无论是在消费电子还是工业设备中，DSS24 都能带来优异的性能表现，成为设计工程师的有力工具。选择 DSS24，助力您的项目成功、提升系统效率与可靠性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
