Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CJ 3DD13003
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- CJ 3DD13003
- Type
- CJ
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CJ
- Electronic Component
- 3DD13003
- Electronic Component
- 1
- Package
- TO-252-2
- Electronic Component
- 1 NPN
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 2.708g
- Electronic Component
- 1
- Electronic Component
- BM0227365618
- Operating Temperature
- 55℃~+150℃
- Transistor Type
- NPN
- Frequency(f T)
- 5MHz
- Power Dissipation(Pd)
- 2W
- Electronic Component
- Electronic Component
- Electronic Component
- 2500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
3DD13003 产品概述
一、概述
3DD13003 为高压 NPN 功率晶体管，品牌 CJ（江苏长电/长晶）提供的器件适用于高压开关和功率放大场合。器件标称型号常见为 3DD13003，描述中出现 TO-126 标识，但本件封装信息为 TO-252-2，实际采购时请以出厂数据表为准。该器件单片数量：1 个 NPN。
二、主要电气参数
- 直流电流增益 hFE：≈40（测试条件：Ic = 0.5 A，Vce = 5 V）
- 集电极-基极截止电流 Icbo：1 mA
- 集电极电流 Ic（最大）：1.5 A
- 集电极-发射极击穿电压 Vceo：400 V（高压等级，适合中低频高压开关）
- 射极-基极击穿电压 Vebo：9 V
- 特征频率 fT：≈5 MHz（适合中低频开关，非高频 RF 场合）
- 集电极饱和电压 VCE(sat)：约 600 mV（参考条件下，如 Ic=1 A、Ib=0.25 A）
- 耗散功率 Pd：2 W（温升显著，需注意散热）
- 工作温度范围：-55 ℃ 至 +150 ℃
三、典型应用场景
- 开关电源（如反激式或隔离型电源）中的高压开关管
- 线性或开关式功率放大与驱动电路（中低频）
- 灯光驱动、家电控制和工业控制中的高压开关应用
- 要求高 Vce 而电流中等（≤1.5A）且频率不高的电路
四、使用要点与设计建议
- 散热管理：Pd 仅 2 W，且在高 Vce 与中等 Ic 条件下损耗较大，建议在实际 PCB 设计中增加大面积铜箔或采用散热片，必要时限制连续导通时间。
- 驱动要求：hFE 在 0.5 A 条件下约 40，开关时需提供足够的基极电流（Ib ≈ Ic/hFE），同时注意基极电容与恢复时间对开关速度的影响。
- 开关损耗与速度：fT ≈ 5 MHz，适合中低频应用；在高频开关场合切换损耗和延迟会增大，需评估能否满足效率要求。
- 保护措施：基极-射极击穿电压仅 9 V，避免直接加大反向电压；电路应设计限流与电压钳位（如二极管或 RC 吸收）以防击穿和浪涌。
- 寿命与可靠性：高温长期工作会影响可靠性，建议在最大结温以下运行并参考数据手册的热阻参数进行热仿真。
五、封装与采购注意
- 本件标注封装为 TO-252-2，描述中出现 TO-126，购买时务必核对供应商给出的封装图与引脚定义，避免装配错误。
- 在选型时若需更高频率或更低饱和压，应考虑替代型号；若需更大功耗或更高电流，应选择更大封装或并联方案并注意热均流。
- 建议获取并参照厂家完整数据手册（包含 V-I 曲线、开关特性、热阻及引脚定义）以完成电路设计与可靠度评估。
总结：3DD13003 为一款高耐压、中等电流的 NPN 功率晶体管，适用于需要 400 V 等级开关能力且频率不高的电源与控制场合。合理的热设计、基极驱动与过压保护是保证其可靠工作的关键。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
