WMSIC Electronic Components

CJ BZX584C9V1

ModelBZX584C9V1
PackageSOD-523
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ BZX584C9V1
Type
CJ
Minimum package
8000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJ
Electronic Component
BZX584C9V1
Electronic Component
1
Package
SOD-523
Electronic Component
Zener Diode
Electronic Component
0.011g
Electronic Component
1
(Zzk)
100Ω
(Zzt)
15Ω
Electronic Component
BM0227654054
Diode
1
Current(Ir)
500nA@6V
Power Dissipation(Pd)
150mW
Electronic Component
8.5V~9.6V
Electronic Component
55℃~+150℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZX584C9V1 产品概述

一、产品简介

BZX584C9V1 为 CJ(江苏长电/长晶)旗下的一款独立式稳压二极管(稳压管),标称稳压值为 9.1V,实际稳压范围为 8.5V ~ 9.6V。该器件采用 SOD-523 小型贴片封装,适用于对体积和成本敏感、需要稳压、基准或过压钳位的低功耗电路。器件工作结温范围宽(-55℃ ~ +150℃),适合多种环境应用。

二、主要电气参数

  • 稳压值(标称):9.1V
  • 稳压值(范围):8.5V ~ 9.6V
  • 反向电流 Ir:500 nA @ VR = 6V
  • 阻抗:Zzk = 100 Ω(低电流区域/击穿转折区动态阻抗指标),Zzt = 15 Ω(在测试电流下的动态阻抗)
  • 耗散功率 Pd:150 mW(器件最大耗散功率,需考虑散热与环境温度)
  • 工作结温:-55℃ ~ +150℃
    这些参数反映出该器件适合低电流稳压与参考用途,低泄漏电流适合高阻抗输入的应用场景。

三、封装与热性能

器件封装为 SOD-523,极其紧凑,适合高密度贴片电路板。SOD-523 的小封装限制了热散能力,因此在实际应用中需关注功耗与环境温度对结温的影响。理论上在理想散热条件下,最大稳态电流 Iz_max 可由 Pd/Vz 估算:Iz_max ≈ 150 mW / 9.1 V ≈ 16.5 mA;但实际设计应按数据手册的热阻和热降额曲线进行电流、功率的降额处理,避免长时间接近最大耗散功率。

四、典型应用场景

  • 小功率电压稳压与基准(为低电流电路提供稳定 9.1V 参考)
  • 过压钳位与保护(防止输入突波超过安全阈值)
  • 仪表、传感器、便携式设备与消费电子中的偏置电路
  • 在要求小体积、低成本的设计中替代较大功率稳压器(注意电流限制)

五、选型与使用建议

  • 若电路需持续供给较大电流,应考虑更高 Pd 的封装或线性稳压器;BZX584C9V1 适合小电流、参考或钳位用途。
  • 对高稳定性低噪声要求的应用,应关注 Zzt(动态阻抗)和温度系数;若需精确参考,选择更低阻抗、温漂更小的器件或配合滤波电容。
  • 对高阻抗输入电路(例如采样放大器),500 nA 的反向泄漏在 6V 情况下已相对较小,但在更高反向电压或更高温度下泄漏会增加,应评估对电路的影响。
  • 焊接与回流:遵循厂家推荐的回流温度曲线与焊接工艺,避免过热;SOD-523 为小封装,机械应力需注意。

六、测试与可靠性建议

  • 在开发阶段请按数据表规定的测试电流测量稳压电压(VZ),并在目标温度范围内验证温漂与泄漏特性。
  • 做热仿真或实测结温,验证在预期工作条件下不会超过最大耗散功率或结温上限。
  • 长期可靠性与寿命评估应考虑工作结温、循环温度、湿度与电压应力等因素。器件工作结温范围宽,适合大多数工业与民用环境,但封装散热仍是关键限制因素。

七、注意事项与保管

  • 器件为半导体敏感器件,搬运与贴装时做好静电防护(ESD)。
  • 存储与运输请遵循厂家的包装与湿敏等级(MSL)要求,必要时进行烘干处理以防回流焊时受潮炸裂。
  • 最终设计时以厂家完整数据手册为准,特别是关于热阻、回流规范、温度系数与降额曲线的详细说明。

总结:BZX584C9V1 是一款适合低功耗、小体积场合的 9.1V 稳压二极管,具有低泄漏、宽工作温度范围和小型 SOD-523 封装,适用于稳压、基准和钳位等应用场景。在选型和使用时需重视功耗热管理与工作电流的降额设计,按数据手册规范进行验证和可靠性评估。

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