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CJ BZX584B16
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- CJ BZX584B16
- Type
- CJ
- Minimum package
- 8000
Technical parameters
- Electronic Component
- CJ
- Electronic Component
- BZX584B16
- Electronic Component
- 1
- Package
- SOD-523
- Electronic Component
- Zener Diode
- Electronic Component
- 0.011g
- Electronic Component
- 1
- (Zzk)
- 200Ω
- (Zzt)
- 40Ω
- Electronic Component
- BM0264603583
- Diode
- 1
- Current(Ir)
- [email protected]
- Power Dissipation(Pd)
- 150mW
- Electronic Component
- 15.68V~16.32V
- Electronic Component
- 55℃~+150℃
- Electronic Component
- 8000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BZX584B16 稳压二极管 产品概述
一、概述
BZX584B16 为一只独立式低功耗稳压二极管，标称稳压值 16V，实际稳压范围为 15.68V ～ 16.32V（典型公差 ±2%），由 CJ（江苏长电/长晶）生产，封装为 SOD-523。器件针对小体积、低功耗应用设计，适合在空间受限和对稳压精度有一定要求的便携及消费电子产品中作为基准电压源或浪涌/尖峰钳位元件使用。
二、主要电气参数
- 稳压值（标称）：16V
- 稳压值范围：15.68V ～ 16.32V
- 反向电流 Ir：100 nA @ 11.2 V（在指定反向偏压下的漏电特性）
- 动态阻抗：Zzt = 40 Ω（工作区），Zzk = 200 Ω（拐点/低电流区）
- 耗散功率 Pd：150 mW（最大耗散，注意热管理与降额）
- 工作结温范围：-55 ℃ ～ +150 ℃
- 封装：SOD-523（超小型贴片）
三、器件特点与优势
- 小体积：SOD-523 封装，可实现高密度 PCB 布局，适合移动设备和空间受限的应用。
- 低漏电：在中等偏压下反向电流极小（100 nA 量级），适合低电流偏置与精密参考场合。
- 宽温度范围：-55 ℃ 至 +150 ℃ 的结温范围，适合工业级应用。
- 稳压精度较好：±2% 范围内的稳压值，有利于对稳压精度有要求的电路设计。
- 适用性强：可用作电压基准、过压/浪涌钳位、偏置稳定以及信号线路保护等。
四、典型应用场景
- 便携式设备与手持终端中的基准电压与偏置电路。
- 供电管理中用于浪涌或瞬态过压钳位保护。
- 精密模拟/混合信号电路的电压参照或偏置源（在允许的功耗条件下）。
- 高密度 PCB 或表面贴装产品的空间受限稳压需求。
五、设计与使用建议
- 注意功耗与热管理：器件最大耗散 150 mW，设计时应保证结温在允许范围内，必要时通过 PCB 铜箔扩散热量或降低工作电流以防止过热。
- 考虑动态阻抗影响：在不同工作电流下 Zzt/Zzk 不同，低电流区稳压能力较弱，电路设计需保证稳压二极管工作在合适电流区以获得所需稳压性能。
- SOD-523 封装体积小，焊接与回流工艺需符合厂家推荐的温度曲线，以避免机械或热损伤。
- 在高精度参考应用中，配合适当滤波和温度补偿手段可进一步提升稳定性。
产品型号示例：BZX584B16（CJ，SOD-523）。如需进一步的电气特性曲线、引脚图或封装及回流焊工艺资料，建议参考厂家数据手册以获得完整规范与测试条件。
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