WMSIC Electronic Components

CJ CJBA3134K

ModelCJBA3134K
PackageDFN1006-3L
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ CJBA3134K
Type
CJ
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJ
Electronic Component
CJBA3134K
Electronic Component
1
Package
DFN1006-3L
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
0.01g
Electronic Component
1
Electronic Component
BM0227310091
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
100mW
Electronic Component
Electronic Component
Electronic Component
10000
Voltage(Vdss)
20V
Capacitor(Ciss)
120pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CJBA3134K 产品概述

一、产品简介

CJBA3134K 为江苏长电(CJ)推出的一款小功率 N 沟道场效应管(MOSFET),封装为 DFN1006-3L,适用于空间受限的表面贴装应用。器件额定漏源电压为 20V,典型导通电阻 RDS(on)=500mΩ(VGS=4.5V),阈值电压 VGS(th)=1.1V,连续漏极电流 750mA,功耗额定 Pd=100mW。工作温度范围宽 (-55℃ ~ +150℃),适合工业级与商用环境。

二、主要性能特点

  • 漏源电压(Vdss):20V,适合低压电源域应用。
  • 导通电阻:500mΩ @ VGS=4.5V,属于中等偏高的 RDS(on),在小电流场合效率可接受。
  • 阈值电压:1.1V,接近逻辑电平,易于由低电压逻辑直接驱动(但在 VGS=4.5V 下性能更佳)。
  • 低功耗封装:Pd=100mW,适用于轻载或间歇导通场景。
  • 输入/反向传输电容:Ciss=120pF,Crss=15pF,开关速度适中,利于 EMI 控制与开关损耗平衡。
  • 宽温度范围:-55℃~+150℃,可靠性满足严苛环境需求。

三、热管理与使用限额

尽管标称连续电流为 750mA,但热耗散仅 100mW,需注意热限带来的实际可持续电流。按 P=I^2·R 估算,基于 RDS(on)=0.5Ω,最大连续电流约为: Imax ≈ sqrt(Pd / RDS) = sqrt(0.1 / 0.5) ≈ 0.45A(约 450mA)。 因此在无额外散热情况下,连续工作电流建议控制在 300–450mA 范围,超过时需考虑散热增强或降额使用。

四、典型应用场景

  • 电池供电设备的低压侧开关与负载切换(便携设备、可穿戴)。
  • 电源管理与电流路由(次级开关、回路断开)。
  • 中低电流的驱动与保护电路(指示灯、传感器供电开关)。
  • 需要小封装、节省 PCB 面积的嵌入式应用。

五、设计与布局建议

  • 门极驱动:建议使用 4.5V 闭合驱动以获得标称 RDS(on),在快切换场合可并联合适阻尼电阻(10–100Ω)以抑制振铃。
  • 门极上拉/下拉:增加 100kΩ 左右下拉以防开路浮空误导通。
  • 热管理:DFN1006-3L 为小型封装,建议在 PCB 背面或器件下方设计热沉铜箔,增大散热面积并通过过孔导热。
  • 布线:缩短源、漏、门极走线,避免大环路面积,减小寄生电感导致的开关应力。
  • 保护电路:对感性负载建议加 RC 或 TVS 限制反压,防止器件进入击穿或承受能量冲击。

六、选型与注意事项

在选用 CJBA3134K 时,务必根据实际工作电流与平均功耗进行热预算;对于持续大于 300–400mA 的负载,建议选择更低 RDS(on) 或更高 Pd 的器件。注意数据手册中的 VGS 测试条件与 RDS(on) 标称条件保持一致,设计时考虑工作温度对 RDS(on) 的上升影响。总之,CJBA3134K 适合对体积和成本敏感、负载中低、工作电压 <20V 的通用开关与功率路径管理场合。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.