Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CJ 1SS387
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- CJ 1SS387
- Type
- CJ
- Minimum package
- 8000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CJ
- Electronic Component
- 1SS387
- Electronic Component
- 1
- Package
- SOD-523
- Electronic Component
- Switch Diode
- Electronic Component
- 0.011g
- Electronic Component
- 1
- Electronic Component
- BM0264603589
- Current
- 100mA
- Diode
- Electronic Component
- Current(Ir)
- 500nA@80V
- (Vf)
- 1.2V@100mA
- Power Dissipation(Pd)
- 150mW
- Electronic Component
- Electronic Component
- Electronic Component
- 8000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1SS387 产品概述
一、产品简介
1SS387 是一款由 CJ（江苏长电/长晶）提供的独立式开关/检波二极管，采用 SOD-523 超小封装，面向高频开关、快速整流与信号检波应用。器件在 100mA 工作点下具有较低正向压降（Vf = 1.2V@100mA）和快速恢复特性（Trr = 4ns），同时具备 80V 的直流反向耐压，适合小功率、空间受限的便携式或通信设备中使用。
二、主要参数
- 封装：SOD-523（独立式）
- 最大耗散功率 Pd：150 mW
- 连续整流电流 If：100 mA
- 直流反向耐压 Vr：80 V
- 正向压降 Vf：1.2 V @ 100 mA
- 非重复峰值浪涌电流 Ifsm：2 A
- 反向电流 Ir：500 nA @ 80 V
- 反向恢复时间 Trr：4 ns
三、产品特点
- 小型封装（SOD-523），占板面积小，适合高密度布局；
- 低正向压降，在 100mA 水平下依然能保持较低功耗；
- 快速开关/恢复能力（Trr 4ns），适用于高频信号切换与整流；
- 低反向漏电（500 nA@80V），利于低功耗/高阻态电路设计；
- 合理的浪涌承受能力（Ifsm 2A），可应对短时瞬态冲击。
四、典型应用
- 高频开关及整流电路；
- 射频/中频检波与限幅电路；
- 移动终端、可穿戴设备等空间受限的电源与信号路径；
- 通信模块、传感器前端的保护或整流用途。
五、设计与可靠性建议
- 为保证长期可靠性，连续工作电流建议在额定 If（100mA）以下并考虑适当余量；
- 由于耗散功率仅 150 mW，高占空比或持续高电流场合需关注热沉与 PCB 散热；
- SOD-523 为细小贴片封装，推荐使用经过验证的回流焊工艺与合适的焊盘设计以避免焊接缺陷；
- 在高反向电压环境下，注意电路板爬电距离与过压保护，以降低瞬态击穿风险。
六、封装与订购说明
本器件为 SOD-523 小封装，适合自动贴装生产。订购时请确认供应商 CJ（江苏长电/长晶）提供的完整型号、包装卷带规格及出厂测试报告，以保证批次一致性与可靠性。
如需基于 1SS387 的典型参考电路、PCB 焊盘尺寸建议或更详细的温升/冲击测试数据，可提供进一步需求，我将为您补充具体设计参考。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
