WMSIC Electronic Components

CJ BZX584C8V2

ModelBZX584C8V2
PackageSOD-523
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ BZX584C8V2
Type
CJ
Minimum package
8000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJ
Electronic Component
BZX584C8V2
Electronic Component
1
Package
SOD-523
Electronic Component
Zener Diode
Electronic Component
0.011g
Electronic Component
1
(Zzk)
80Ω
(Zzt)
15Ω
Electronic Component
BM0227654052
Diode
1
Current(Ir)
700nA
Power Dissipation(Pd)
150mW
Electronic Component
7.7V~8.7V
Electronic Component
55℃~+150℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZX584C8V2 产品概述

一、产品简介

BZX584C8V2 是 CJ(江苏长电/长晶)系列的小功率稳压二极管,采用 SOD-523 超小贴片封装,标称稳压值 8.2V。该器件为独立式(单只)稳压二极管,适用于空间受限、对功耗要求较低的基准/稳压和钳位电路。器件具有工艺一致性好、漏电小、工作结温宽 (-55℃ 至 +150℃) 等特点,适合移动设备、传感器前端、微功耗电路的辅助稳压或保护用途。

二、主要参数

  • 稳压值(标称):8.2V
  • 稳压范围:7.7V ~ 8.7V
  • 反向漏电流 Ir:700 nA(在 5V 反向偏置时)
  • 耗散功率 Pd:150 mW(结温及环境条件限制下的最大耗散)
  • 动态阻抗:Zzt = 15 Ω(测试条件下),Zzk = 80 Ω(膝部阻抗)
  • 工作结温范围:-55℃ ~ +150℃
  • 封装:SOD-523(超小表贴)
  • 型号:BZX584C8V2(CJ)

三、典型应用场景

  • 小电流基准与偏置:为模拟电路提供简单的电压基准或偏置节点。
  • 过压保护与浪涌钳位:在低能量瞬态下保护下游电路。
  • 电池供电与便携设备:用于低功耗模块的辅助稳压或参考点。
  • 信号链电压钳位:限制输入/输出峰值,保护 ADC、放大器等器件。

四、设计与使用注意事项

  1. 最大稳压电流估算:理论最大稳压电流 Iz(max) ≈ Pd / Vz = 0.150 W / 8.2 V ≈ 18.3 mA。但该值为在允许器件耗散的极限条件下的理论值,实际应用应按热环境与寿命进行降额(建议连续工作电流取 Iz ≤ 50% 的 Pd 限值,即约 8–10 mA)。
  2. 限流设计:务必采用串联限流电阻 R = (Vin - Vz) / Iz 来限制稳压电流。例如 Vin=12V,目标 Iz=5mA,则 R ≈ (12-8.2)/0.005 ≈ 760 Ω(可选 820 Ω 标准值)。
  3. 漏电与温漂:反向漏电 700 nA 在低压条件下较小,但随温度升高会增加,敏感电路需考虑温漂影响。
  4. 动态阻抗与纹波:Zzt=15 Ω 表明在工作电流下有一定动态阻抗,作为精密参考时噪声及负载变动会影响稳压精度;需配合滤波或后级缓冲(如跟随器)改善性能。
  5. 膝部特性:Zzk = 80 Ω 表示在低电流区的非线性较大,低电流工作点下稳压不稳定,应避免长时间在膝部电流区工作。

五、封装与焊接建议

SOD-523 为超小封装,有利于高密度贴装。推荐按制造商提供的回流焊工艺资料执行,注意回流温度曲线与湿热保存等级(MSL)。PCB 布局上在二极管焊盘周围保留适量铜箔以利散热,但不要以此作为主要散热依赖,仍需通过限流控制功耗。

六、选型建议与可靠性

  • 若需较高稳压精度或低噪声参考,应选用专用基准源或低噪声放大器;BZX584C8V2 更适合成本敏感的通用钳位与低功耗偏置场合。
  • 对于脉冲大电流或过压能量较高的场合,应选用额定功率更高的稳压二极管或加入吸收器件以保护 SOD-523 器件。
  • 设计时参考环境温度、PCB 散热条件与长期可靠性要求,适当降额使用可显著提高可靠性。

如需更详细的电气特性曲线、回流焊曲线或管脚/封装尺寸图,请参考 CJ(长电/长晶)的产品数据手册或联系供应商获取原厂资料。

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