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CJ BZX584C30
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- CJ BZX584C30
- Type
- CJ
- Minimum package
- 8000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CJ
- Electronic Component
- BZX584C30
- Electronic Component
- 1
- Package
- SOD-523
- Electronic Component
- Zener Diode
- Electronic Component
- 0.011g
- Electronic Component
- 1
- (Zzk)
- 300Ω
- (Zzt)
- 80Ω
- Electronic Component
- BM0227654056
- Diode
- 1
- Current(Ir)
- 100nA
- Power Dissipation(Pd)
- 150mW
- Electronic Component
- 28V~32V
- Electronic Component
- 55℃~+150℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BZX584C30 稳压二极管（CJ 长晶）产品概述
一、产品简介
BZX584C30 是江苏长电（CJ/长晶）生产的一款小功率硅稳压二极管，型号后缀 Y11 为出厂批次/工艺标识。该器件以稳定的反向稳压特性和微小封装尺寸为特点，适用于空间受限的表面贴装电路，用作参考电压源、浪涌钳位及电压抑制等场合。
二、主要规格参数
- 标称稳压值（VZ）：30 V
- 稳压值允许范围：28 V ～ 32 V
- 反向电流（IR，典型/最大）：100 nA（在指定反向电压下）
- 最大耗散功率（Pd）：150 mW
- 稳态阻抗（Zzt）：80 Ω
- 转折区阻抗（Zzk）：300 Ω
- 工作结温范围：-55 ℃ ～ +150 ℃
- 封装：SOD-523（超小型表贴）
三、电气性能与热性能说明
BZX584C30 在规定的测试电流下表现出较低的稳态阻抗（Zzt≈80Ω），意味着在工作电流范围内具有较好的电压稳定性；在靠近击穿或低电流转折区时阻抗增大（Zzk≈300Ω），稳压性能下降，应避免长期在该区间工作。器件最大耗散功率为150 mW，属于小功率级别，使用时必须通过串联限流电阻或选择外部散热/降额运行来控制结温，防止超出功耗或结温极限。
四、封装与机械特性
SOD-523 为超小型表面贴装封装，适合高密度组装和便携式设备。该封装对热量的散发能力有限，焊盘设计与PCB铜箔面积会直接影响器件的热性能和长期可靠性。Y11 标识通常用于生产批次及追溯。
五、典型应用场景
- 精密电压参考与偏置电路（低功耗场合）
- 低电流浪涌抑制与输入保护
- 移动设备、可穿戴电子、传感器模块等空间受限且功耗受控的系统
- 小信号稳压及基准源替代方案（对精度和纹波抑制要求不高的场合）
六、使用与选型建议
- 确认工作电流：由于器件为小功率稳压二极管，应设计合理的串联限流元件，确保在最大耗散功率范围内运行。
- 检查稳压需求：器件稳压范围为28–32 V，如果系统对稳压精度要求高，应选用更精密的参考源或并联滤波/缓冲放大电路。
- 注意温升与降额：在高环境温度或连续高电流工况下按温度特性进行功率降额，增大PCB热散面积或采用辅助散热手段。
- 考虑阻抗影响：较高的动态阻抗在负载变化或噪声敏感电路中会影响稳定性，必要时并联低噪声缓冲放大器。
七、储存与可靠性注意事项
- 遵循常规SMD元件的防潮和回流焊温度规范，避免超过封装和结温极限。
- 储存于干燥环境，防止吸湿导致回流焊时产生焊接缺陷。
- 生产批次（如 Y11）应做好追溯，长期存放或大批量应用时建议进行样品可靠性验证。
总结：BZX584C30 适合用于体积受限且功耗受控的应用场景，提供中等电压等级的稳压参考。设计时重点关注功率耗散、工作电流及热管理，才能发挥其性能并保证长期可靠性。
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