WMSIC Electronic Components

CJ ES2D

ModelES2D
PackageSMAG
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ ES2D
Type
CJ
Minimum package
5000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJ
Electronic Component
ES2D
Electronic Component
1
Package
SMAG
Electronic Component
Fast Recovery / High-Efficiency Diode
Electronic Component
0.112g
Electronic Component
1
Electronic Component
BM0230014262
Current
2A
Diode
1
Current(Ir)
5uA@200V
(Vf)
950mV@2A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ES2D 产品概述

一、产品简介

ES2D 是江苏长电(CJ/长晶)推出的一款独立式快恢复、高效率整流二极管(封装:SMAG)。该器件在2A工作电流下正向压降典型为0.95V,直流反向耐压200V,反向电流仅5µA(Vr=200V),反向恢复时间Trr约35ns,非重复峰值浪涌电流Ifsm可达50A,结温工作范围宽(Tj = -55℃ ~ +150℃)。总体定位为中功率开关电源与整流场合的高效率快恢复二极管。

二、主要参数要点

  • 封装:SMAG(SMA 型玻封/玻封类似封装,便于波峰/回流焊接与自动贴装)。
  • 正向压降 Vf:0.95V @ If = 2A(低 Vf 有利于降低导通损耗)。
  • 额定整流电流 If(AV):2A。
  • 反向耐压 Vr:200V(适用于中高压整流与开关电源次级整流)。
  • 反向电流 Ir:5µA @ 200V(低漏电,有利于提高待机效率)。
  • 反向恢复时间 Trr:35ns(属于快恢复类型,适配高频开关,但非超快恢复或肖特基级别)。
  • 峰值浪涌 Ifsm:50A(短时冲击吸收能力良好)。
  • 工作结温:-55℃ ~ +150℃。

三、性能优势与设计意义

  • 低正向压降(0.95V)直接降低导通损耗:在2A连续工作时器件自身耗散约1.9W(Pd≈Vf×If),需按实际散热条件计算并做好热设计。
  • 35ns 的快恢复特性在典型SMPS二极管整流、反并联回收或钳位回路中,可有效减少反向恢复引起的开关损耗与电磁干扰(EMI)。
  • 低漏电流与宽工作温区提升系统待机效率与可靠性,适合消费类电源、适配器和LED驱动等应用。

四、典型应用场景

  • 开关电源(SMPS)次级整流或整流桥替代件。
  • AC/DC 适配器、电池充电器、LED 驱动电源。
  • 电机驱动与逆变器的自由轮回路(中频场合)。
  • PFC 折返、钳位/吸收电路以及一般功率整流。

五、使用与布局建议

  • 热管理:连续2A条件下需关注器件导热至焊盘与PCB,建议增大铜箔面积或加散热铜箔/散热片以保证结温在安全范围内。
  • 冲击与浪涌:若应用场合存在频繁或高能量浪涌,应评估Ifsm与浪涌持续时间,并配合熔断/限流元件保护。
  • 并联注意:不建议直接并联多只二极管以提高电流,因正向压降存在差异;若必须并联,应加均流电阻或采用专用并联方案。
  • 开关噪声:在高dv/dt或高速开关中,考虑配合RCD钳位或RC缓冲网络以抑制尖峰与降低EMI。

六、封装与采购提示

  • 型号识别可标注为 CJ ES2D-SMAG(具体管脚与标记以厂家资料为准)。
  • 量产选型时建议索取器件完整数据手册、典型曲线(Vf-T、Ir-T、Trr波形)及可靠性报告,以便进行热仿真与寿命评估。

总结:ES2D 以低正向压降、适中快恢复时间和较低漏电流,在SMAG封装中为中功率、高效率整流场合提供一个性价比较高的选择。设计时重点关注散热和开关浪涌管理,以充分发挥其快恢复与低损耗优势。

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