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CJ CJAC100P03
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- CJ CJAC100P03
- Type
- CJ
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CJ
- Electronic Component
- CJAC100P03
- Electronic Component
- 1
- Package
- PDFNWB5x6-8L
- Electronic Component
- 1 P
- Electronic Component
- MOSFET
- Electronic Component
- 0.118g
- Electronic Component
- 1
- Electronic Component
- BM0227330805
- Operating Temperature
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
- Voltage(Vdss)
- 30V
- Capacitor(Ciss)
- 12nF
- Gate (Qg)
- 210nC@10V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CJAC100P03 产品概述
一、概述
CJAC100P03 是江苏长电（CJ）推出的一款高性能 P 沟道场效应管（MOSFET），针对高电流、高效能的高侧开关与功率控制场合优化设计。器件支持最高漏源电压 30V，低导通电阻与大电流承载能力，使其在汽车电子、工业电源和电池管理系统等 12V/24V 领域具有良好适配性。
二、主要电气参数
- 漏源电压 Vdss：30V
- 导通电阻 RDS(on)：2.3 mΩ @ Vgs = 10V
- 连续漏极电流 Id：100 A
- 栅极阈值电压 Vgs(th)：约 1.2 V（典型）
- 总栅极电荷 Qg：210 nC @ 10V
- 输入电容 Ciss：12 nF @ 25V
- 反向传输电容 Crss：750 pF @ 25V
- 数量/极性：1 个，P 沟道
- 封装：PDFNWB5x6-8L（带散热垫的小型扁平封装）
三、主要特性与优势
- 极低的导通损耗：2.3 mΩ 的低 RDS(on) 在高电流工作下可显著降低导通功耗与发热，提升系统效率。
- 大电流能力：100 A 连续电流能力使其适合瞬态及持续高负载应用。
- 适合高侧开关：P 沟道结构便于在正电源一侧实现高侧开关，简化驱动电路（相较于 N 沟道的高侧驱动更简单）。
- 可靠封装：PDFNWB5x6-8L 提供较好的散热路径与 PCB 安装可靠性。
四、封装与热管理建议
PDFNWB5x6-8L 封装带有底部散热垫，建议 PCB 采用多层铜铺和热过孔（thermal vias）将热量引导至内层/背面散热层，以降低结到环境热阻。具体热阻和结温限制请参照完整数据手册并根据工作温度（-55℃ ~ +150℃）进行热设计与降额。
五、栅极驱动与开关考量
器件 Qg 较大（210 nC），意味着快速切换时需要较高的驱动电流或专用驱动器以控制开关损耗与切换时间。Crss（750 pF）使得在开关瞬态中会有显著的 Miller 效应，需注意栅极到源的电压耦合与可能的振荡。建议：采用适当阻值的栅极电阻、驱动能力 ≥ 数安培的驱动器、必要时配合阻尼或缓冲网络以控制 dv/dt。
六、典型应用场景
- 汽车与车载电源的高侧负载开关与断路控制
- 电池管理系统（BMS）中的充放电控制与反接保护
- 点火/点亮负载切换、DC-DC 升降压模块的保护开关
- 工业控制与高功率电机驱动的保护/切换元件
七、选型与使用建议
- 工作在高温或长期连续高电流场合时，应进行降额设计并验证结温（Tj）。
- 由于较大的栅极电荷，频繁高速开关会带来显著的开关损耗，若用于高频切换，需评估驱动损耗与整体效率。
- 使用前请参考 CJ 官方完整数据手册，核实最大 Vgs、瞬态脉冲能力、SOA 及封装热参数，确保满足系统可靠性要求。
若需更详细的电气特性曲线、热阻参数或参考电路图，我可以帮助检索或解析数据手册并给出 PCB 布局及驱动网络的具体建议。
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