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CJ BZX584C3V6
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- CJ BZX584C3V6
- Type
- CJ
- Minimum package
- 8000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CJ
- Electronic Component
- BZX584C3V6
- Electronic Component
- 1
- Package
- SOD-523
- Electronic Component
- Zener Diode
- Electronic Component
- 0.011g
- Electronic Component
- 1
- (Zzk)
- 600Ω
- (Zzt)
- 90Ω
- Electronic Component
- BM0227654039
- Diode
- 1
- Current(Ir)
- 5uA@1V
- Power Dissipation(Pd)
- 150mW
- Electronic Component
- 3.4V~3.8V
- Electronic Component
- 55℃~+150℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BZX584C3V6 产品概述
一、产品简介
BZX584C3V6 为独立式小信号稳压二极管（齐纳/稳压管），标称稳压值 3.6V，规格范围 3.4V～3.8V。器件由 CJ（江苏长电/长晶）生产，采用 SOD-523 超小封装，适合空间受限的表面贴装应用。器件设计用于对小电流回路实现简单、廉价的电压稳压与浪涌钳位。
二、主要电气参数
- 标称稳压：3.6V（范围 3.4V～3.8V）
- 反向电流 Ir：≤5 μA（在 1.0V 条件下）
- 阻抗：Zzk = 600 Ω，Zzt = 90 Ω（规格表内给出，用以评估小信号动态特性）
- 耗散功率 Pd：150 mW（器件额定耗散，设计时须考虑热限）
- 工作结温范围：-55℃ ～ +150℃
注：上述阻抗与反向电流为器件典型/限值参数，具体应用时请参考厂方完整数据曲线确定工作点与稳定性。
三、封装与布局要点
SOD-523 为超小型贴片封装，适用于高密度 PCB。由于封装体积小、热阻较高，功耗管理尤为重要：在接近额定 Pd 时建议采取降额设计、加大铜箔面积以改善散热，并在 PCB 布局中为稳压二极管提供热扩散路径及合理的过孔散热。
四、典型应用
- 低功耗信号线电压基准与参考
- 输入浪涌或反向钳位保护（配合串联电阻）
- 模拟与数字电路的小范围电压稳压
- 移动设备、便携式仪器及高密度消费类电子
五、使用建议
- 选择工作电流时应兼顾稳压精度与功耗：小信号稳压管在微安到数毫安范围内特性变化明显，建议参考 I-V 曲线并在允许的 Pd 范围内工作。
- 串联限流或分流电阻可设定通过电流并限制功耗。
- 在高温或密封环境中应进行功耗降额，以避免结温超限。
- 对稳压精度有较高要求时，应评估温度漂移与动态阻抗对输出的影响。
六、质量与采购提示
CJ（江苏长电/长晶）生产的 BZX584C3V6 适合量产与工程样品验证。采购时确认完整型号、封装（SOD-523）、批次及放行报告；要求批量应用时建议索取器件曲线、可靠性试验及封装尺寸图以便设计验证与寿命评估。
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