WMSIC Electronic Components

CJ ST10100L

ModelST10100L
PackageTO-277
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ ST10100L
Type
CJ
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJ
Electronic Component
ST10100L
Electronic Component
1
Package
TO-277
Electronic Component
Schottky Diode
Electronic Component
0.128g
Electronic Component
1
Electronic Component
BM0226987108
Current
10A
Diode
Electronic Component
Current(Ir)
20uA@100V
(Vf)
590mV@10A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ST10100L 产品概述

一、概述

ST10100L 为 CJ(江苏长电/长晶)出品的独立式肖特基二极管,封装为 TO-277。器件设计用于高电流整流与低损耗导通场合,典型正向压降为 590mV@10A,直流额定整流电流 10A,直流反向耐压 100V,适用范围广泛且可靠性高。

二、主要电气参数

  • 器件类型:肖特基二极管(独立式)
  • 正向压降 (Vf):590mV @ IF = 10A
  • 额定直流整流电流:10A
  • 直流反向耐压 (Vr):100V
  • 反向电流 (Ir):20μA @ Vr = 100V
  • 非重复峰值浪涌电流 (Ifsm):200A(短时浪涌)
  • 工作结温范围:-55℃~+150℃

三、热特性与可靠性

TO-277 封装有利于散热与安装至散热器。实际的结-外壳热阻与结-环境热阻请参见器件数据手册并依据 PCB 与散热器设计进行热仿真。在高结温工况下应按数据手册中的电流-温度降额曲线进行设计,保证长期可靠性。

四、典型应用场景

  • 开关电源(SMPS)整流与续流二极管
  • 电池充电与电源管理系统
  • 直流-直流变换器、太阳能逆变器的快速整流
  • 电机驱动与车载电子的反向保护与续流路径

五、封装与装配建议

TO-277 封装便于通过螺栓或导热垫与散热器紧密接触。建议采用大铜箔区域与多走线填铜方式以降低寄生电阻与温升;固定与散热面需平整,拧紧力矩按机械手册要求;焊接与回流操作应遵循厂家焊接温度曲线,防止过热损伤器件。

六、选型与使用注意

  • 虽为低 Vf 肖特基二极管,但在高电流长期工作时仍需关注结温和散热能力。
  • 反向漏电流随温度显著上升,高温工况下需留有余量。
  • 浪涌电流能力为短时峰值,重复或长时间冲击应避免或提供额外保护(限流、保险)。

七、采购与替代

品牌:CJ(江苏长电/长晶),封装:TO-277,型号:ST10100L。选型时若需更高耐压或更低正向压降,可参考同类肖特基或快速恢复二极管,比较 Vf、Ir、Ifsm 及热阻规格以确定替代方案。购买与技术细节请以厂方最新数据手册为准。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.