WMSIC Electronic Components

CJ BZX584B5V1

ModelBZX584B5V1
PackageSOD-523
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ BZX584B5V1
Type
CJ
Minimum package
8000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJ
Electronic Component
BZX584B5V1
Electronic Component
1
Package
SOD-523
Electronic Component
Zener Diode
Electronic Component
0.011g
Electronic Component
1
(Zzk)
480Ω
(Zzt)
60Ω
Electronic Component
BM0228678253
Diode
1
Power Dissipation(Pd)
150mW
Electronic Component
5V~5.2V
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZX584B5V1(BZX584B 系列)产品概述

一、产品简介

BZX584B5V1 是一款小功率稳定二极管,标称稳压值为 5.1V(实际允许范围 5.0V~5.2V),由 CJ(江苏长电/长晶)生产,封装为 SOD-523。该器件以体积小、工艺兼容 SMT、成本低为特点,适合用于低功耗微型电路中的基准稳压、浪涌/过压钳位以及信号保护等场景。

主要参数概览:

  • 稳压值(标称):5.1V
  • 稳压值(范围):5.0V ~ 5.2V
  • 耗散功率 Pd:150 mW
  • 动态阻抗 Zzt:60 Ω
  • 弯曲区阻抗 Zzk:480 Ω
  • 工作结温范围:-55 ℃ ~ +150 ℃
  • 封装:SOD-523(超小型表面贴装)
  • 备注:型号后缀“2Z2”通常为厂方包装/出货代码,具体以 datasheet 与供应商说明为准

二、主要电气性能解读

  • 稳压特性:5.1V 的标称值说明在规定测试电流下器件进入反向击穿工作区时输出接近 5.1V 的稳压电压。标称范围 5.0~5.2V 表示器件允许的制造公差。
  • 动态阻抗:Zzt=60 Ω 表示在测试电流附近斜率(微分电阻)较高,说明其作为精密基准时稳定性有限;Zzk=480 Ω 为低电流弯曲区阻抗,表明在很小的电流下伏安曲线较陡,电压与电流关系非线性较强。
  • 功率与电流:器件允许最大耗散为 150 mW。理论上在稳压电压 Vz≈5.1V 时的最大电流 Imax≈150mW/5.1V ≈ 29 mA。但受封装热阻和寿命影响,不建议长时间在接近此极限的电流下使用,应按热额定和散热条件进行降额。

三、典型应用场景

  • 基本基准电源:为小型低速电路提供简单的参考电压或低精度稳压,常与限流电阻配合形成并联稳压(分流稳压)方案。
  • 浪涌或过压钳位:在小功率信号线路或供电线路中作为电压钳位元件,防止偶发过压损坏下游器件。
  • 信号保护:保护敏感输入端免受脉冲或反向电压影响。
  • 功能替代:在对精度要求不高但要求成本和体积严格受限的应用中替代体积更大或成本更高的稳压器。

四、使用与设计注意事项

  • 电流限流:设计时按 R = (Vin - Vz) / Iz 计算限流电阻,确保在最大工作电压下通过二极管的电流不会超过安全热限。示例:若 Vin = 12V,目标 Iz = 5 mA,则 R ≈ (12 - 5.1) / 0.005 ≈ 1.38 kΩ。
  • 功率核算:同时计算限流电阻的功率耗散与二极管自身耗散。器件在高环境温度或密集布板时需进一步降额。
  • 精度与噪声:由于 Zzt 与 Zzk 较大,该器件不适合作为高精度参考源;若需更低噪声、更低阻抗的基准,请选用精准基准芯片或温度补偿型器件。
  • 温度影响:稳压电压随结温变化,应参考厂方给出的温度系数并在设计中考虑热漂移对系统精度的影响。
  • 封装限制:SOD-523 为极小型封装,散热能力有限,适合低功率应用。焊接时遵循制造商提供的回流焊工艺曲线,避免过热导致性能劣化或可靠性下降。

五、封装与可靠性

SOD-523 为超小型表面贴装封装,适合高密度 PCB 与自动贴片生产。由于体积小、引脚和散热面有限,器件热阻较大,建议在板上为其留足散热路径或限制工作电流。器件工作结温范围宽(-55℃ 到 +150℃),适应工业级温度要求,但长期在高温下工作仍需设计降额以保证可靠性与寿命。

六、选型建议与替代方案

  • 若目标为低成本、空间受限且对稳压精度要求不高的应用,BZX584B5V1 是合适选择。
  • 若需要更低动态阻抗、更高稳定性或更高功耗能力,可考虑更高功率的 SOD-123/DO-214 或线性稳压芯片及精密基准源。
  • 在选购时注意厂方命名后缀(如 2Z2)代表包装或批次信息,采购时核对 datasheet 与供应商的最小订购量、封装带卷规格。

以上内容基于器件主要参数与常见应用经验整理,具体电气特性、测试条件与印刷电路布线建议请参照 CJ 官方 datasheet 与应用说明以获得精确设计数据。

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