WMSIC Electronic Components

CJ 1.5SMC36CA

Model1.5SMC36CA
PackageSMCG
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ 1.5SMC36CA
Type
CJ
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJ
Electronic Component
1.5SMC36CA
Electronic Component
1
Package
SMCG
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.39g
Electronic Component
1
Electronic Component
BM0257713194
Voltage
49.9V
Current(Ir)
1uA
Voltage(VBR)
37.8V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1.5SMC36CA 产品概述

一、产品简介

1.5SMC36CA 是江苏长电(CJ/长晶)出品的一款双向瞬态电压抑制器(TVS),采用 SMCG 封装,针对中高能量浪涌保护场合设计。器件在正常工作电压附近保持极低漏电流,而在瞬态过压时快速进入导通状态,将浪涌能量钳位到安全电平,从而保护下游敏感元件不受损害。

二、主要电气参数

  • 极性:双向(Bidirectional),可用于交流或极性可反转的直流回路。
  • 反向截止电压 Vrwm:30.8 V(典型工作耐受电压)。
  • 击穿电压 Vbr:37.8 V(进入雪崩区的起始电压)。
  • 钳位电压 Vc:49.9 V(在峰值脉冲条件下的最大钳位电压)。
  • 峰值脉冲电流 Ipp:30.5 A @ 10/1000 μs(标准浪涌波形下的峰值电流能力)。
  • 峰值脉冲功率 Ppp:1.5 kW @ 10/1000 μs(器件单次冲击时的能量吸收能力)。
  • 反向电流 Ir:1 μA(在 Vrwm 条件下的典型漏电流,静态功耗低)。
  • 类型:TVS,用于瞬态过压抑制与浪涌能量吸收。

三、性能特点

  • 高能量吸收:在 10/1000 μs 浪涌波形下可承受 30.5 A 峰值电流与 1.5 kW 峰值功率,适合需要较大冲击能量处理的场合。
  • 低钳位比:钳位电压 49.9 V 相对于击穿 37.8 V,钳位效率高,能将瞬态电压控制在较小超出安全范围内。
  • 低漏电流:1 μA 的低静态漏电有助于降低系统待机功耗。
  • 双向保护:无需额外元件即可对正负极性冲击或交流尖峰进行对称抑制,适用于数据线、总线与电源回路的双向过压保护。

四、典型应用场景

  • 工业电源与分布式电源保护:24–36 V 档电源线上对雷击、开关浪涌和感性负载反激的保护。
  • 通信设备与基站前端:对电源线与差分总线的瞬态抑制,保障模块正常工作。
  • 汽车电子辅助电路(视车规认证情况):用于车载子系统的浪涌/反向瞬态防护。
  • 工控设备与仪表:用于输入保护、继电器驱动回路和接口防护。

五、PCB布局与焊接建议

  • 走线最短:将 TVS 到接地平面的走线尽量缩短,以降低环路电感,提高抑制效果。
  • 充足散热铜箔:SMCG 封装需要良好散热,建议在封装下方和焊盘处配置铜面和热陷,必要时增加过孔导入内层散热层。
  • 焊接工艺:遵循 SMC/SMCG 常规回流焊温度曲线,避免过热时间过长,以保障封装与焊点可靠性。
  • 去耦与滤波配合:在需要时与滤波电容、共模电感搭配使用,以获得更全面的电磁兼容防护。

六、选型注意事项与可靠性

  • 验证环境电压:Vrwm 30.8 V 适合 24–36 V 级别保护,选型时确认系统正常工作电压与瞬态容许范围。
  • 浪涌路径与频次:尽管器件能承受高能量冲击,频繁的大能量浪涌会影响寿命,应根据实际冲击能量和次数考虑冗余或更高等级保护。
  • 温度与功率退化:在高温条件下器件钳位和能量吸收能力会受影响,设计时留有适当余量并参考完整数据手册的温度特性曲线。
  • 数据手册确认:具体封装尺寸、引脚标识、热阻及可靠性试验数据等请以 CJ 官方数据手册为准,关键应用建议进行实际浪涌试验验证。

总结:1.5SMC36CA 以其双向抑制特性、较高的能量吸收能力和低漏电流,适合要求可靠浪涌保护且空间有限的中功率应用场景。在实际工程中应结合 PCB 布局和热管理优化,以发挥最佳防护效果。

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