WMSIC Electronic Components

CJ CJAA3134K

ModelCJAA3134K
PackageWBFBP-03E
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ CJAA3134K
Type
CJ
Minimum package
10000

Technical parameters

Electronic Component
CJ
Electronic Component
CJAA3134K
Electronic Component
1
Package
WBFBP-03E
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
0.097g
Electronic Component
1
Electronic Component
BM0230137745
Operating Temperature
40℃~+150℃
Power Dissipation(Pd)
100mW
Electronic Component
10000
Voltage(Vdss)
20V
Capacitor(Ciss)
120pF
Resistor(RDS(on))
800mΩ@1.8V
Voltage(Vgs(th))
350mV

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CJAA3134K 产品概述

一、主要性能指标

CJAA3134K 是一款单个 N 沟道场效应管(MOSFET),适用于低压小功率开关场合。主要参数如下:

  • 数量:1 个 N 沟道
  • 漏源电压 Vdss:20 V
  • 连续漏极电流 Id:750 mA
  • 导通电阻 RDS(on):800 mΩ @ Vgs=1.8 V, Id=0.45 A
  • 功率耗散 Pd:100 mW
  • 阈值电压 Vgs(th):350 mV
  • 输入电容 Ciss:120 pF;反向传输电容 Crss:15 pF
  • 工作温度范围:-40 ℃ ~ +150 ℃
  • 品牌:CJ(江苏长电/长晶)
  • 封装:WBFBP-03E

二、产品特性

  • 低压、低功耗设计:20 V 的耐压等级适合 USB、便携式电源以及一般汽车电子的辅助电路。阈值电压低(约 350 mV),配合 1.8 V 门驱可实现逻辑电平驱动。
  • 中等导通电阻与小电容:RDS(on) 在 1.8 V 驱动下为 800 mΩ,适合小电流开关或信号级负载;Ciss=120 pF 与 Crss=15 pF 表明在开关速度与驱动功耗之间有平衡,适用于低频或中速切换场景。
  • 小封装、适合空间受限应用:WBFBP-03E 小封装利于高密度 PCB 布局与表面贴装工艺。

三、典型应用场景

  • 便携设备的电源路径开关、负载切换与电源管理(PMIC)辅助开关
  • 电池保护电路中作为低电流断开/旁路开关
  • 信号切换、级间隔离或小电流继电器替代
  • 低速 PWM 调光、小电流电机驱动(需注意热限)

四、热与电气使用注意事项

  • 功率耗散限制:器件 Pd 仅 100 mW,需注意功耗计算。举例在 Id=0.45 A 且 RDS(on)=0.8 Ω 时,静态耗散约为 P=I^2·R ≈ 0.45^2×0.8 ≈ 0.162 W,已超出额定 Pd,说明在不采取额外散热措施时不能在此电流下长期工作。设计时应限制持续电流或采用短脉冲工作、增大铜箔散热面积、并置多器件或改用更低 RDS(on) 的型号。
  • 驱动电压与性能关系:RDS(on) 数据以 Vgs=1.8 V 标定,若使用更低门电压,导通电阻会增大;若使用更高门压(在器件允许范围内),导通性能可改善。请参阅完整数据手册获取绝对最大 Vgs 值并遵守限制。
  • 开关损耗与寄生电容:Ciss 和 Crss 描述了驱动能量和米勒效应;在快速开关时需控制驱动电流避免过大开关能量导致瞬时发热。
  • PCB 布局建议:尽量缩短漏源回流路径、扩大器件下方和周边的铜面积以提高散热;并在门极处并联阻容网络以抑制振铃与过冲,尤其在较长驱动线或较高 dV/dt 环境中。

五、封装与选型建议

WBFBP-03E 小封装适合体积受限的消费类与工业应用,但其散热能力有限。若电路存在较大持续电流或频繁开关情形,建议:

  • 评估实际工作电流与占空比,必要时选择 Pd 更高或 RDS(on) 更小的替代件;
  • 对热敏感应用采用外部散热或并联多只器件分担电流;
  • 在规范化设计前参考 CJ 官方数据手册以获取完整的极限参数、SOA 曲线与封装引脚定义。

总体而言,CJAA3134K 适合作为低电压、小电流的开关器件,适用于便携式电源管理与信号切换场景。购买与最终设计前,请以厂方最新数据手册为准并进行热仿真与实测验证。

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