WMSIC Electronic Components

CJ 1SMA5929A

Model1SMA5929A
PackageSMAG
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ 1SMA5929A
Type
CJ
Minimum package
5000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJ
Electronic Component
1SMA5929A
Electronic Component
1
Package
SMAG
Electronic Component
Zener Diode
Electronic Component
0.11g
Electronic Component
1
(Zzk)
600Ω
(Zzt)
9Ω
Electronic Component
BM0257375245
Diode
1
Power Dissipation(Pd)
1.5W
Electronic Component
14.25V~15.75V
Electronic Component
55℃~+150℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1SMA5929A 产品概述

一、产品简介

1SMA5929A 是江苏长电(CJ/长晶)生产的一款表面贴装型稳压二极管,封装为 SMAG(SMA 类封装),主要用于低功耗稳压、过压钳位和电路保护场景。该器件标称稳压值为 15V,稳压值允许范围为 14.25V ~ 15.75V,最大耗散功率为 1.5W,适合用作低至中等功率的并联稳压或吸收瞬态能量的钳位器件。工作结温范围为 -55℃ 到 +150℃,适应较广的工业环境温度要求。

二、主要电气参数(关键参数列举)

  • 标称稳压值(Vz):15V
  • 稳压值允许范围:14.25V ~ 15.75V
  • 反向漏电流(Ir):500 nA @ 11.4V
  • 最大耗散功率(Pd):1.5 W(在规定散热条件下)
  • 动态阻抗(Zzt):9 Ω(表征在规定测试电流下的稳态动态阻抗)
  • 膝部阻抗(Zzk):600 Ω(表征低电流区或击穿起始区的阻抗)
  • 工作结温范围:-55℃ ~ +150℃
  • 封装:SMAG(SMA 类贴片封装)
  • 品牌:CJ(江苏长电/长晶)

三、参数意义与性能解读

  • 15V 的稳压值适合为 12V~24V 等电源系统中间节点提供基准或做电压钳位。稳压范围 ±5%(14.25~15.75V)反映了在典型测试电流下的制造公差和温度特性。
  • 反向漏电流仅 500 nA(在 11.4V 下测得),说明在小电流或待机电路中作为参考或并联稳压时功耗非常低。
  • Zzt = 9 Ω 表示在规定测试电流下动态阻抗较低,稳压性能好;Zzk = 600 Ω 表示在击穿起始或极低电流区时斜率阻抗较高,意味着在极小电流下电压稳定性会下降。
  • Pd = 1.5 W 为器件在良好散热条件下的最大耗散能力,实际应用中需考虑封装散热与环境温度对功耗的影响并进行降额设计。

四、典型应用场景

  • 并联稳压(低功耗电路的 15V 参考)
  • 输入过压保护与瞬态钳位(与限流电阻搭配用于抑制短时过压脉冲)
  • 模拟/混合信号电路的电压基准或偏置来源
  • 仪表、通信设备、工业控制模块及其它需要稳定 15V 参考或保护的场合

五、使用与设计要点

  • 并联稳压场合:采用串联限流电阻与稳压二极管并联负载的传统拓扑,稳压电流 Iz 应选择使得 Zzt 在低值区工作以获得较好的稳压性能。稳压二极管功耗 Pz = Vz × Iz,必须保证 Pz ≤ Pd,并在高环境温度下考虑降额。
  • 过压保护场合:用于吸收短时能量时需确保器件的平均功耗和峰值能量在安全范围内;若有较大瞬态能量,应与吸收网络(如限流电阻、能量吸收电容)或更大功率的 TVS 共同使用。
  • 温度与功耗:在高温环境下器件承受的允许耗散会下降,建议在长期运行时将实际耗散控制在 Pd 的 50%~70% 以下以延长寿命和提高可靠性。
  • 极性与安装:作为稳压二极管通常在反向击穿区工作,使用时阴极接更正电位一侧,阳极接地或更低电位。SMAG 封装适合表面贴装工艺,需按厂商 Reflow 工艺指南控制回流温度曲线以避免热应力损伤。

六、可靠性与注意事项

  • 避免长期在最大额定功率附近工作,长期过热会加速老化并可能引起参数漂移。
  • 器件的稳压特性对测试电流、温度和安装散热条件敏感,设计时请参考器件完整数据手册获取测试条件和曲线(如 Vz vs Iz、Vz vs Tj、IR vs Vr 等)。
  • 在需要更高瞬态功率吸收能力或更严格动态阻抗要求的保护场合,应考虑更高 Pd 的 TVS 或并联多颗器件解决方案。

七、封装与采购信息

  • 封装:SMAG(SMA 类贴片)——适合自动贴装、回流焊工艺。
  • 生产厂商:CJ(江苏长电/长晶)。
  • 选型时请确认所购器件的完整型号、是否为单向/双向版本(若应用于交流或双向钳位需注意型号差异)以及生产批次与质量认证。

总结:1SMA5929A 为一枚适用于低至中等功率稳压与保护的 15V 稳压二极管,具有低漏电、高结温耐受和较低动态阻抗的特点。合理的电路设计与热管理能确保其在多种工业与消费类电子场景中稳定可靠地工作。若需更详细的电气测试曲线和封装尺寸,请参考厂商提供的完整版数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.