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CJ BZX584C2V4
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- CJ BZX584C2V4
- Type
- CJ
- Minimum package
- 8000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CJ
- Electronic Component
- BZX584C2V4
- Electronic Component
- 1
- Package
- SOD-523
- Electronic Component
- Zener Diode
- Electronic Component
- 0.046g
- Electronic Component
- 1
- (Zzk)
- 600Ω
- (Zzt)
- 100Ω
- Electronic Component
- BM0227654062
- Diode
- 1
- Current(Ir)
- 50uA@1V
- Power Dissipation(Pd)
- 150mW
- Electronic Component
- 2.2V~2.6V
- Electronic Component
- 55℃~+150℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BZX584C2V4（Z11）简要概述
一、产品简介
BZX584C2V4（Z11）为小功率稳压（二极管）器件，标称稳压值2.4V，由CJ（江苏长电/长晶）生产，常见封装为SOD-523，适用于表面贴装自动化生产。该器件属于低电流、低功耗的齐纳/稳压二极管系列，常用于电压基准、浪涌/过压钳位与局部小电流稳压场合。
二、主要电气参数
- 标称稳压值（Vz）：2.4V
- 稳压值允许范围：2.2V ~ 2.6V
- 反向漏电流（Ir）：50 μA @ 1V（说明在反向1V时漏电约50μA）
- 最大耗散功率（Pd）：150 mW（器件在允许散热条件下的最大耗散）
- 封装：SOD-523（SMD，小型化）
注：数据以器件典型规格为准，具体工作点下的稳压精度、动态电阻和温度系数请参考厂家完整数据手册。
三、典型应用场景
- 低压基准源：为微控制器ADC、低速采样电路提供简易参考电压（注意精度与温漂限制）。
- 电压钳位/保护：作为输入端或敏感节点的过压限幅器，抑制瞬态冲击。
- 电源去耦与局部稳压：在电源回路中与限流电阻配合，形成简单的并联稳压源。
- 便携与物联网设备：体积小、功耗低，适用于空间和能耗受限的终端产品。
四、使用建议与典型计算
- 常用工作电流范围：该类小功率稳压二极管常在数十微安到数毫安范围内工作；设计时应避免长期接近Pd极限。
- 串联电阻计算（典型）：当用作并联稳压器时，设定期望稳压电流Iz，可用R = (Vin - Vz) / Iz估算。
示例：Vin = 5V，Vz = 2.4V，若选择Iz = 1mA，则R ≈ 2.6 kΩ。 - 最大稳流估算：理论上 Iz_max ≈ Pd / Vz，代入Pd=150mW、Vz=2.4V，Iz_max≈62 mA，但实际应考虑封装散热、环境温度及脉冲特性，设计时需有充分裕量并参考温度降额曲线。
- 漏电与偏置注意：反向电流在低压差条件下可能较大（例：1V时50 μA），对高阻电路或低功耗待机态须评估其影响。
五、封装与可靠性要点
- SOD-523为极小型SMD封装，适合高密度布局，但散热能力有限；焊接时按推荐回流温度曲线作业以保证可靠性。
- 自动贴片友好，通常以卷带（tape-and-reel）供货，便于批量装配。
- 对潮湿敏感性与焊接热稳定性请参考厂家包装说明和MSL等级，储存与回流焊工艺应遵循建议。
六、选型与替代考虑
- 若需更高精度、低温漂的参考，请考虑专用基准源（例如带温补的基准IC）。
- 若工作电流或能量冲击较大，应优先选用更高Pd或更大封装的稳压二极管以保证可靠性。
- 采购时确认厂家型号命名、批次与原厂/授权代理渠道，避免混淆替代品。
总结：BZX584C2V4是一款面向低功耗、空间受限应用的小型稳压二极管，适合用于基本电压基准与过压保护场合。设计时应重点关注工作电流、耗散功率与封装散热限制，并参照完整数据手册确定具体应用边界与焊接要求。
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