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CJ BZX584C4V7
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- CJ BZX584C4V7
- Type
- CJ
- Minimum package
- 8000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CJ
- Electronic Component
- BZX584C4V7
- Electronic Component
- 1
- Package
- SOD-523
- Electronic Component
- Zener Diode
- Electronic Component
- 0.011g
- Electronic Component
- 1
- (Zzk)
- 500Ω
- (Zzt)
- 80Ω
- Electronic Component
- BM0227654040
- Diode
- 1
- Current(Ir)
- 3uA@1V
- Power Dissipation(Pd)
- 150mW
- Electronic Component
- 4.4V~5V
- Electronic Component
- 55℃~+150℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BZX584C4V7 产品概述
一、产品简介
BZX584C4V7 为独立式小功率稳压二极管，标称稳压值 4.7V，器件由 CJ（江苏长电/长晶）生产，封装为 SOD-523。该器件体积极小、适合表面贴装，适用于要求占位小、功耗低的电路中作为简单稳压源或浪涌/过压保护元件。
二、主要电气参数
- 稳压值（标称）：4.7V
- 稳压值范围：4.4V ~ 5.0V（出厂批次与测试条件会影响分布）
- 反向漏电流 Ir：3 µA @ 1.0V（典型测试条件）
- 耗散功率 Pd：150 mW（在良好散热条件下）
- 动态阻抗 Zzt：80 Ω（在规定测试电流下的阻抗）
- 阈区阻抗 Zzk：500 Ω（接近击穿起始点时的阻抗）
- 工作结温范围：-55 ℃ ～ +150 ℃
- 封装：SOD-523（超小型表贴）
注：描述中有时提到 Ir=3µA@2V，具体漏电流随测试电压与温度变化，选型时请以器件出厂数据表为准。
三、热性能与散热建议
器件额定耗散功率为 150 mW，SOD-523 封装热阻较大，实际可通过 PCB 铜箔面积、热过孔及良好散热布局提高热能力。理论上在理想散热条件下最大稳压电流约为 Pd/Vz ≈ 150mW/4.7V ≈ 32 mA，但在实际应用中应做降额（建议工作电流远低于此值），并考虑环境温度和封装散热限制。
四、典型应用场景
- 低电流稳压参考：为小电流传感器或逻辑门提供简单参考电压（配合限流电阻）。
- 输入过压/浪涌保护：保护 ADC 输入、GPIO 或敏感电路免受瞬态过压。
- 夹位电路：限制信号电压幅度，防止信号进入危险区。
- 电池供电与便携设备：用于对低功耗子电路做轻量稳压或浪涌抑制。
五、选型要点与使用注意
- 稳压精度：4.4V~5.0V 的范围表明器件为普通精度类型，不适合作为高精度参考源。
- 漏电流影响：Ir 为 µA 级，适合多数中低阻抗电路；在高阻电路或超低功耗休眠态下，需评估漏电流对系统的影响。
- 动态阻抗：Zzt 和 Zzk 较大，随工作电流不同稳压特性会有明显变化，电路中应预估压降与纹波。
- 热降额：尽量使工作电流控制在安全区，并在 PCB 布局上提供额外散热铜箔以提高可靠性。
- 焊接与可靠性：SOD-523 封装对回流温度敏感，遵循厂家推荐回流曲线可避免损伤。长期工作在高温环境下需关注结温不超过上限。
六、替代与配套建议
需要更低动态阻抗或更高功率时，可考虑更大封装或功率等级的稳压二极管；若对稳压精度要求更高，建议使用专用低漂移基准源。选型时对比同类 4.7V 型号（如 BZX 系/BZT 系）时要核对测试电流、阻抗、耗散和封装一致性。
总之，BZX584C4V7 适合用于占位小、对精度和功耗有严格要求但电流需求不高的稳压与保护场景。设计时重点关注工作电流、热管理和漏电流对系统功耗与精度的影响，并以器件最新数据表为准进行电路验证。
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